Origin Code plans CES 2026 debut for VORTEX DDR5 memory with detachable triple-fan cooler
Origin Code says it will debut its VORTEX DDR5 memory series at CES 2026 in Las Vegas.
The headline feature is a detachable active cooling module that mounts over the DIMMs. Origin Code claims this is the first DDR5 design with a removable triple-fan unit aimed at keeping tighter timings stable during longer loads.
VORTEX DDR5 configurations listed by Origin Code
- Speed & Latency Focus: 6200 MT/s CL26 | 32 GB (2x 16 GB)
- Dual-Profile Performance: 6000 MT/s CL26 (Base) / 8000 MT/s CL36 (Profile 2) | 48 GB (2x 24 GB)
- High Capacity: 6000 MT/s CL26 | 192 GB (4x 48 GB)
- Max Density: 6000 MT/s CL30 | 256 GB (4x 64 GB)
- 1DPC Specialist: 6000 MT/s CL26 (Base) / 8000 MT/s CL36 (Profile 2 – 1DPC) | 96 GB (2x 48 GB)
On cooling, the company describes three 4020 dual-ball bearing fans rated at 22.5 CFM, with PWM control from 800 to 8000 RPM. The heatsink uses what Origin Code calls a patented “ScaleCut” geometry with 0.75 mm double-beveled recesses, and it claims up to 39.8% higher heat dissipation efficiency versus passive cooling.
Source: Origin Code
Origin Code says the kits are tuned mainly for AMD platforms via EXPO profiles, while still offering different capacity and latency targets. It also states the DIMMs can run at their guaranteed EXPO speeds without the fan module, and that validation was done across ASUS, MSI, and Gigabyte motherboard platforms.
At the booth, Origin Code plans demos focused on sustained overclocking under real workloads, an active-versus-passive cooling comparison, and full systems built around the VORTEX kits.
Source: Origin Code PR
