Akasa, a leading provider of thermal solutions, introduced the Skyline 3 Pro, an aluminium fanless case with a skyline shaped top cover, designed for the ASUS Tinker Board 3 and 3S single-board computers (SBCs). The Skyline 3 Pro offers passive cooling in a compact form factor, making it ideal for diverse embedded applications, including digital signage, edge AI and IoT, smart retail/kiosk, medical and other enterprise systems that require maintenance-free operation in silent environments.

The Skyline 3 Pro's sandblasted, anodized aluminium body serves not only as a protective shell but also as a passive heatsink. The custom thermal module and
included thermal pads draw heat away from the SBC's "hot zones" and dissipate it into the surrounding air through the sculpted "skyline" ridged heatsink fins, which are designed to maximize surface area for effective cooling.