MediaTek's growing partnership with Google has reportedly prompted a shift in development priorities; industry insiders propose an ongoing "realignment" of internal resources. The alleged formation of a dedicated ASIC division seems to be draining staff away from the more visible Dimensity mobile chip projects—by previous announcement s, a very important aspect of the Taiwanese fabless semiconductor firm's business. Going back to March 2025 , MediaTek and Google partnered up on the making of a seventh-gen "Ironwood" Tensor Processing Unit (TPU) design. Later in the year, it emerged that MediaTek engineers were assisting on Google's even more futuristic "Zebrafish" TPUv8x project .

Industry analysts posit that the demands of formulating Google's complex/intricate 3 nm TPU v7 design has taken precedence within MediaTek operations; prompting the rumored formation of a full-fledged ASIC department. Another key factor seems to be a tight timeline that leads to significant volume orders of Google TPUs. According to a Commercial Times Taiwan news article, mass production is expected to start within the third quarter of 2026. Future targets include five million units pumped out by 2027, followed by an ambitious seven million unit goal in 2028. Similarly, Broadcom is "actively preparing production capacity" for its Google TPU collaboration. Local reportage points out that Rick Tsai—MediaTek's Vice Chairman and CEO—anticipates pleasing financial results related to his team's "first ASIC project." Smooth progress in 2026 could lead to an approximate $1 billion revenue contribution, with forecasts of several billion dollars in 2027. Another major earner could emerge from a speculated deal with Meta—MediaTek's second ASIC project is said to be based on an unnamed 2 nm node process.