SK hynix expands memory lineup at CES 2026 With 48GB HBM4 and SOCAMM2
SK hynix is using CES 2026 to show its next wave of AI-focused memory products. The company says the booth is meant to strengthen direct talks with key customers around future AI platforms.
The headline demo is a 16-layer HBM4 stack with 48 GB, shown publicly for the first time. SK hynix positions it as the follow-up to its 12-layer HBM4 (36 GB), which the company says reached 11.7 Gbps, and notes that development is aligned to customer schedules.
Source: SK Hynix
SK hynix is also bringing a 12-layer HBM3E stack with 36 GB, which it expects to be a key product for the market this year. It also plans a joint display with a customer showing GPU modules for AI servers that use HBM3E, to put the memory in a system context.
Source: SK Hynix
Outside HBM, the booth includes SOCAMM2 , a low-power memory module aimed at AI servers, plus LPDDR6 for on-device AI . On the storage side, SK hynix is showing a 321-layer 2 Tb QLC NAND part aimed at high-capacity enterprise SSDs for AI data centers, with claimed gains in power efficiency and performance over the prior QLC generation.
An “AI System Demo Zone” rounds out the exhibit with a set of forward-looking concepts, including custom HBM (cHBM), processing-in-memory (PIM), an AiMX accelerator card prototype, compute-using-DRAM (CuD), a compute-enabled CXL memory module concept (CMM-Ax), and a data-aware computational storage drive (CSD).
Source: SK Hynix
