MSI has unveiled the MEG X870E UNIFY-X MAX motherboard at CES 2026
The company says the board pairs its OC Engine with a dedicated two-slot memory layout, and backs that up with an 18+2+1 power design using 110A SPS. Cooling is handled by an oversized heatsink assembly with a Direct Touch Cross Heat-pipe, plus a double-sided EZ M.2 Shield Frozr II and 9W/mK thermal pads.
MSI also advertises modern connectivity and storage for the platform. MEG X870E UNIFY-X MAX includes Wi-Fi 7, 5G LAN, and five PCIe Gen5 x4 M.2 slots, aimed at low-latency networking and fast local storage for data-heavy workflows.
MSI also confirmed that its AM5 lineup supports the upcoming AMD Ryzen 7 9850X3D, which MSI lists as an 8-core, 16-thread Zen 5 processor with 3D V-Cache, 104 MB total cache, up to 5.6 GHz boost, and a 120 W max TDP.
Source: MSI/TechPowerUP
MSI points to CLICK BIOS X features such as Latency Killer, High-Efficiency Mode, Performance Preset, and X3D Gaming Mode, and says an AGESA PI pre-1.3.0.0 BIOS update is planned to further improve compatibility and performance.
MSI has not shared pricing or a release date for MEG X870E UNIFY-X MAX.
Source: MSI, TechPowerUP
