AMD at the 2026 International CES announced the new Ryzen AI 400 series "Gorgon Point" mobile processors powering the company's client processor lineup through 2026. These chips are based on the new 4 nm "Gorgon Point" silicon that is a refresh of the current "Strix Point" monolithic processor supporting higher clock speeds across its various compute components, and updates to its power management. The processor implements the "Zen 5" microarchitecture, and uses a dual-CCX CPU with four full-sized "Zen 5" cores sharing a 16 MB L3 cache, and eight compact "Zen 5c" cores sharing an 8 MB L3 cache. The "Zen 5" cores boost up to 5.20 GHz, while the iGPU goes up to 3.10 GHz engine clock. The chip features an iGPU based on the RDNA 3.5 graphics architecture with 16 compute units (CU). Both the CPU and iGPU feature improved boost residency over "Strix Point."

Besides the CPU and iGPU, the integrated NPU also gets a performance uplift, with increased NPU clock speeds enabling a peak throughput of 60 TOPS, up from 55 TOPS on Ryzen AI 300 series processors. AMD has also given the processor a feature-packed ROCm software stack, so client AI software can leverage this 60 TOPS NPU and the AI acceleration capabilities of the iGPU and CPU. Lastly, AMD has updated the integrated memory controllers, giving them native support for LPDDR5X 8533 MT/s memory speeds, an increase from the 8000 MT/s that "Strix Point" natively supports. Despite these improvements, "Gorgon Point" remains mostly similar to "Strix Point" at a physical level, and so AMD took the opportunity to refresh the way the various Ryzen AI 400 series processor models are segmented from this silicon, giving each SKU an improvement over its Ryzen AI 300 series predecessor. This could be anything from CPU clock speeds, to CPU core-count, to iGPU CU count, and NPU throughput.