AMD Ryzen 7 9850X3D smiles for camera
PC Games Hardware and Club386 have published close-up photos of AMD’s Ryzen 7 9850X3D, including shots of the AM5 package with and without the heat spreader. PC Games Hardware did not say where the CPU was photographed, but the sample appears to be an OEM unit that likely came from an AMD briefing or a system integrator channel.
AMD has so far only shared generic 9000X3D imagery, and one official-style chip image circulating from AMD materials appears to show two CCDs. That does not match what is expected for the 9850X3D. These PC Games Hardware photos are the first clear look at the actual retail-style package layout.
Source: PC Games Hardware
Here it is – AMD Ryzen 7 9850X3D in the flesh at CES 2026! #amd #CES2026 pic.twitter.com/AWbsYImf9z
— Club386 (@theclub386) January 7, 2026
The images show the I/O die in the center, with a single Zen 5 CCD below it. PC Games Hardware also reiterates the key change for Ryzen 9000X3D, where the 3D V-Cache sits below the CPU cores instead of above them, which should help cooling and allow higher boost clocks under load.
The German media also lists markings from the chip. The sample is labeled as manufactured in week 37 of 2025 , and the OPN is 100-000001973 for the OEM CPU, with the boxed part expected as 100-100001973WOF. The label also indicates Malaysia (“PGY”) as the manufacturing location.
Availability for this CPU is currently expected in Q1 2026, and some OEM listings have pointed to February.
Source: PC Games Hardware
