ATP Electronics, the global leader in specialized storage and memory solutions, becomes the first e.MMC manufacturer to further shrink the e.MMC size to 6.7 mm. Built on 125-ball Fine Ball Grid Array (FBGA), the new E700Pc / E600Vc solutions shatter dimension constraints, making them the world's smallest and the first of its kind. As a further miniaturization of the previous "smallest" package of 7.2 x 7.2 mm introduced in early 2025, the new e.MMC offerings are 67% smaller compared to standard-sized e.MMC while retaining superior advantages such as massive power savings and thermal resilience, making them ideal for applications where energy and space are premium considerations.

This achievement was made possible by ATP's expertise and commitment to customer-driven innovation, especially with the heightened demand for smart wearables such as smart glasses, which have rigid space limitations on top of low power requirements for extended use.