Tesla has finalized the development of its AI5 automotive processor, allowing for production at TSMC and Samsung facilities. This advancement also revives the previously halted Dojo 3 supercomputer project. CEO Elon Musk announced that the AI5 chip will offer performance on par with NVIDIA's "Hopper" architecture, with two AI5 units equaling the power of a single "Blackwell" processor. The revival of Dojo 3 project was rumored with Intel joining as a key packaging partner , marking a shift from Tesla's earlier dependence on TSMC for complete manufacturing. Intel will manage assembly and testing using its EMIB technology, which connects multiple dies via silicon bridges instead of a full-wafer interposer. This method is better suited to Tesla's large Dojo modules that combine several 654 mm² chips into a single package.

Also based on previous information, Samsung will produce the D3 training chips at its Texas facility using a 2 nm process, leaving Intel to oversee packaging operations exclusively. This division of labor addresses capacity constraints and provides Tesla with more flexibility in customizing interconnect layouts. For the AI5 automotive chips, both Samsung and TSMC will create distinct versions, but Tesla aims to ensure identical software performance across both. Initial projections suggest the AI5 could operate at just 150 W while matching the performance of NVIDIA's H100 accelerator that requires 700 W. This efficiency is achieved by removing general-purpose graphics subsystems and optimizing the architecture specifically for Tesla's neural processing.