Samsung presented its brand-new Exynos 2700 application processor just before Christmas—this big announcement followed many months of leaks, throughout 2025. Weeks later, a mysterious follow-up model—dubbed "Exynos 2700" by South Korean industry insiders— was tentatively linked to an allegedly more refined 2 nm GAA node process. Officially, Samsung has opted into using its own foundry's SF2 production line for the imminent Exynos 2600 SoC-powered Galaxy S26 smartphone series. Lately, the more advanced "SF2P" node process has been uttered in the same sentence as possible AMD, Qualcomm, and Tesla chip making deals. The South Korean megacorporation is very likely keen to drum up interest from new and returning clients, and their latest Exynos mobile chip is being used as a proof of concept for the regular SF2 node (2 nm GAA), along with proprietary " Heat Path Block " technology.

Unsurprisingly, as the Exynos 2600 AP closes in on its release period, pre-launch samples have posted benchmark data. Last week, TechPowerUp covered this next-gen chip's Geekbench 6 OpenCL score of 24,964 points —achieved by the onboard Xclipse 960 iGPU (aka " JUNO "). Earlier today, a slightly mysterious "Samsung Electronics Co., Ltd. Full Android on S5E9975 ERD" test device posted a not-so-impressive OpenCL score of 15618, in Geekbench 6.2.2 for Android AArch64. A Geekbench browser database entry details a 10-core processor candidate that packs a Samsung Xclipse 970 integrated graphics solution. Presumably, the numerical model climb—from 960 going up to 970—implies the "S5E9975 ERD" validation platform hosting an "Exynos 2700" mobile chipset. At first, Ice Universe—a self-described tech expert of global renown—was excited by the seemingly premature appearance of an "Exynos 2700" engineering sample. A lower than expected benchmark score was blamed on the test setup being an "ERD engineering board."