Earlier last week, more details emerged regarding Intel's rumored top-level 52-core "Nova Lake-S" processor model. According to recent leaks, this flagship Core Ultra Series 4 design is expected to feature a 16 P-core, 32 E-core, and 4 low-power island E-core configuration, paired with big last-level cache (bLLC). An unprecedented 700 W power consumption figure (under full load) was floated by kopite7kimi, with Jaykihn weighing in about the "NVL-S" series' TJMax (Thermal Junction Maximum) not being offset. Also, they mentioned that "thermal throttling cannot be disabled." Days later (on February 13), Jaykihn issued another "preliminary" prediction: "only some (motherboards) will support the full-power 52-core (52C) platform. Other boards will limit the performance and power of the 52C platform." When poring over this information, VideoCardz connected dots between the very best "Core Ultra Series 4" dual-tile options to a speculative and new "Core X" HEDT product lineup.

In theory, the highest level models could bear "Core X9" designations; akin to the recently launched flagship "Panther Lake-H" chip ( Core Ultra X9 388H ). Normally, Intel's workstation-focused Xeon processor families have occupied the HEDT segment. As a fallback hypothesis, VideoCardz envisions the "X" marking being applied exclusively to bLLC-augmented variants—likely specifying advertising elevated gaming performance; similar to AMD's "X3D" naming scheme. In their past weekend report, the popular online publication has dismissed rumors about Team Blue nixing the single-tile (with bLLC) side of the "Nova Lake-S" series. Instead, VideoCardz envisions two "mainstream" single-tile SKUs arriving—later in the year—pipped to take on equivalents within Team Red's Ryzen 7 and 9 desktop processor tiers. Two larger siblings, in premium dual-time form (with bLLC), are anticipated as forming a new HEDT line.