With the demand for its CoWoS chip packaging technology booming, TSMC might be losing some market share to Intel, suggests data from SemiAnalysis Chipbook. CoWoS, which is short for chip-on-wafer-on-substrate (CoWoS), is a key step in the AI chip manufacturing process. It involves combining multiple GPUs and memory chips in a single package, which is then used in a data center or other computing infrastructure.

While TSMC's well-oiled chip manufacturing machine has ensured that global AI computing chips

Alibaba appears to be emulating NVIDIA's well-established vertical integration playbook by bringing day-zero support for its highly capable Qwen-3.8 27B AI model - one that can run on just 32GB of VRAM - to its bespoke RISC-V chip, called XuanTie C950.

Alibaba unveiled the XuanTie C950 in March 2026, marketing the chip as a RISC-V-based offering for edge AI. Unlike typical ASICs, the XuanTie C