Qualcomm is unveiling its breakthrough for the AI data center market called HBC (High-Bandwidth Compute), to break the memory wall.
At its Investors Day 2026, Qualcomm unveiled HBC under its Dragonfly brand , an innovative technology that aims to offer a major boost in memory capacity and bandwidth. The HBC architecture deploys a purpose-built & near-memory solution that bonds compute with boosted memory bandwidth in a 3D stacked chip design. With this, Qualcomm aims to solve the memory bottlenecks that have gripped





![A line graph titled 'Recording time [s]' shows fluctuating frametimes with frequent spikes between 0 and 200 seconds.](/media/wccftech/wp-content/uploads/2026/06/Frame-Time-Graph.jpg)
