Despite the substantial strides taken by Samsung LSI in designing a thermally stable Exynos 2600 chip and an even better Exynos 2700, courtesy of the all-new Side-by-Side (SbS) packaging and the Heat Path Block (HBP) heat sink, Samsung Mobile appears to be doubling down on its dual-chip strategy.
A slew of anecdotal evidence suggests Samsung is giving Qualcomm's Snapdragon 8 Elite Gen 5 an outsized role within the upcoming foldables, including the Galaxy Z Flip 8






