Welcome to Hot Chips! This is the annual conference all about the latest, greatest, and upcoming big silicon that gets us all excited. Stay tuned during Monday and Tuesday for our regular AnandTech Live Blogs.

Welcome to Hot Chips! This is the annual conference all about the latest, greatest, and upcoming big silicon that gets us all excited. Stay tuned during Monday and Tuesday for our regular AnandTech Live Blogs.

Welcome to Hot Chips! This is the annual conference all about the latest, greatest, and upcoming big silicon that gets us all excited. Stay tuned during Monday and Tuesday for our regular AnandTech Live Blogs. Today we start at 8:45am PT, so set your watches and notifications to return back here! The first set of talks is all about CPUs: Intel Alder Lake, AMD Zen 3, IBM Z, and Intel Sapphire Rapids.

Over the last couple of years, a great deal of concern has developed around the future of semiconductor manufacturing, both with respect to total capacity and where the next generation of fabs will be hosted. The current chip crunch has underscored that current fab capacity is too small for a world where there’s a silicon chip in practically everything, and meanwhile geopolitical matters have made nations increasingly worried about where today’s cutting-edge fabs are located – mostly in Taiwan and South Korea. Consequently, we’ve seen governments

This week as part of the annual Hot Chips semiconductor conference, Samsung’s memory division has presented a poster/slides on a project it is currently working on with impressive end-point results. The company details a 512 GB module of DDR5 memory, running at DDR5-7200, designed for server and enterprise use. This is a step up from the 256 GB modules at the top end of the market today, but to get there, Samsung has been introducing some

In our coverage of the semiconductor space, we typically think of two main vectors of hardware – the CPU and the GPU. Beyond that, we look at FPGAs, microcontrollers, and this decade is bringing the advent of the dedicated AI processor. What ties all of these products together is actually the FPGA - a field programmable gate array that allows a skilled technician to essentially build a custom circuit out of configurable gates. This means an FPGA can be used to design and simulate a full CPU or GPU, but also an

Alongside a sneak peek at their forthcoming Xe-HPG architecture , the other big reveal today from Intel’s consumer graphics group comes from the software side of the business. Along with preparing Intel’s software stack for the 2022 launch of the first Arc products, the group has also been hard at work at their own take on modern, neural net-driven image upscaling techniques. The product of that research is Xe Super Sampling, or XeSS, which Intel is pitching as the best solution yet for

This week Intel held its annual Architecture Day event for select press and partners. As with previous iterations, the company disclosed details about its next generation architectures set to come to the market over the next twelve months. Intel has promised the release of its next-generation consumer and mobile processor family, Alder Lake, to come by the end of the year and today the company is sharing a good number of details about the holistic design of the chips as well as some good detail about the microarchitectures that form this hybrid design

For Intel’s 2021 Architecture Day presentations, the yin to the CPU company’s traditional yang is GPUs. Intel has spent the last few years preparing to enter the market for discrete GPUs, with aims of competing in everything from consumer video cards up to HPC-class accelerators. And now, as the company already begins preparing for 2022, those efforts are finally coming to a head. Intel’s big breakout effort in the discrete GPU space starts in earnest next year with Xe

On the back of a myriad of new motherboard launches based on AMD's X570 chipset, we have the MSI MEG X570S Ace Max. The new Max motherboard supersedes the previous X570 Ace, and fittingly has lots of new and improved features. Some of the biggest features of the new Ace Max include a large 18-phase power delivery with premium 90 A power stages and the inclusion of an Intel Wi-Fi 6E wireless interface. Other features include