EIZO Launches ColorEdge CS2740: A 27-Inch 4K Professional Monitor with USB-C
USB Type-C is slowly but surely taking over the display market as the connector of choice. At first, it was added primarily to mainstream office models, but recently manufacturers started to use it on other SKUs too. This month EIZO introduced its new ColorEdge CS2740 professional display with a USB-C connector, one of the first monitors in this class to feature a USB-C interface.
The EIZO ColorEdge CS2740 is a 27-inch 10-bit IPS LCD
Seagate Introduces IronWolf 510 M.2 NVMe SSDs for NAS Systems
Seagate was one of the first vendors to introduce SSDs targeting the consumer / SMB / SME NAS markets with the IronWolf SSD 110 series at the 2019 CES . Western Digital put up their offerings in the market segment in the form of the WD Red SA500 in Q4 2019 . Both SSD families are SATA-based - however, while the WD Red SA500 comes in both 2.5" and M.2 form-factors, the IronWolf 1
Update: NVIDIA GTC 2020 Announcements Postponed Entirely
Update (03/16/2020) : What a difference a week makes. Citing the latest developments in the now coronavirus pandemic, NVIDIA has altered its GTC plans once again. The company is now postponing its GTC announcements entirely . A new date will be scheduled "once the situation stabilizes."
Given the much lower-key nature of NVIDIA's previously planned news releases, I was not expecting the company to bring out its biggest announcements to begin with. But now the matter is
Intel & Micron Sign New 3D XPoint Wafer Supply Agreement
Intel and Micron have inked a new 3D XPoint memory wafer supply agreement. Analysts believe that Intel will now have to pay Micron more than it did previously as it is now the only maker of 3D XPoint. The new pact also shows that Intel wants to continue making products based on 3D XPoint, but details about the products remain to be seen.
Having ended its NAND and 3D XPoint partnerships with Micron, Intel sold its former partner its stake in their mutually owned fab in Lehi, Utah. Since
AMD Details Renoir: The Ryzen Mobile 4000 Series 7nm APU Uncovered
The notebook market has not been kind to AMD over the last decade – for a long, long time the company was only ever seen as the discount option for those on a strict budget. It didn’t help that OEMs only saw AMD in that light, fitting bulky units with sub-standard displays and storage options meant that even retailers were only presenting AMD as something for the budget conscious.
All that seems set to change. Fast forward to 2020, and notebook users are eagerly awaiting the arrival
Biostar Launches Low-Power A10N-9630E Mini-ITX Motherboard
AMD’s Bulldozer microarchitecture was originally designed with mainstream and high-performance applications in mind, but eventually its development took a turn to focus solely on mainstream mobile and desktop PCs. Today, processors based on AMD’s Excavator architecture — the pinnacle of Bulldozer’s evolution — are positioned as entry-level solutions and compete against lower-end products from Intel, including those powered by Atom-class processors that were designed from the ground up to be cheap and energy-efficient. Looking to fill a need for
AMD Announces Ryzen 9 4900H and 4900HS: The Halo 35 W and 45 W Mobile APUs
As part of the disclosures on AMD’s Ryzen Mobile 4000 portfolio, the company is also lifting the lid on perhaps one of the worst kept secrets in mobile computing: the new top-of-the-line Ryzen 9 4900H family. This family consists of two processors, the standard H model built for 45 W operation, and the HS model at 35 W. These parts will offer more frequency and more graphics performance than the rest of AMD’s offerings,
Marvell Announces ThunderX3: 96 Cores & 384 Thread 3rd Gen Arm Server Processor
The Arm server ecosystem is well alive and thriving, finally getting into serious motion after several years of false-start attempts. Among the original pioneers in this space was Cavium, which went on to be acquired by Marvell in 2018. Among the company’s server CPU products is the ThunderX line; while the first generation ThunderX left quite a lot to be desired, the ThunderX2 was the first Arm server silicon that we deemed viable and competitive against Intel and AMD products. Since then, the ecosystem
Apple’s WWDC Confirmed For June; Becomes Latest Conference To Go Digital-Only Due to Coronavirus
In a busy week for SARS-CoV-2-related developments, the virus has caused yet another major industry conference to change their plans. Today Apple has announced that the company’s annual World Wide Developers Conference (WWDC) will be taking place in June after all, but that it will now be a digital-only show. Calling it an “entirely new online format”, Apple is promising news and events for consumers, the press, and of course, developers.
One of the major fixtures of
GlobalFoundries & Everspin Extend MRAM Pact to 12nm
GlobalFoundries and Everspin have announced that the two have extended their Spin-transfer Torque (STT-MRAM) joint development agreement (JDA) to 12LP (12 nm FinFET) platform. The extension will enable GlobalFoundries to produce discrete MRAM chips using their 12nm processes as well as to embed MRAM into chips designed for its 12LP manufacturing technology, which is being used for numerous applications.
The two companies have a long collaboration history that goes back to 40 nm bulk fabrication process and extends to