AMD Financial Analyst Day 2020 Round-Up: Laying A Path For Bigger & Better Things

AMD’s first Financial Analyst Day since 2017 has just wrapped up. In the last three years AMD has undergone a dramatic change, launching its Zen CPU architecture, and greatly improving the trajectory of a company that was flirting with bankruptcy a few years ago. And now that AMD’s foundation is once again secure, the company has gathered to once again talk to its loyal (and looking at stock prices, now much richer) investors and how it’s planning to use this success to push

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Intel

AMD Clarifies Comments on 7nm / 7nm+ for Future Products: EUV Not Specified

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As part of AMD’s Financial Analyst Day 2020, the company gave the latest updates for its CPU and GPU roadmap. A lot of this we have seen before, with the company talking out to Zen 4 and Genoa on its datacenter CPU product line, out to Zen 3 and Ryzen 4000 with the consumer product line, and now with the RDNA/CDNA split between consumer and compute graphics. In previous graphs of a similar nature, AMD used the term ‘7nm+’

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Intel

Updated AMD Ryzen and EPYC CPU Roadmaps March 2020: Milan, Genoa, and Vermeer

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Everyone is interested in roadmaps – they give us a sense of an idea of what is coming in the future, and for the investors, it gives a level of expectation as to where the company might be in a year to five years. Today at AMD’s Financial Analyst Day, the company gave the latest updates on the CPU side of the business, for consumer and for enterprise.

AMD stated that its CPU roadmaps for its enterprise portfolio are going to offer more vision into the future than its consumer side for

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AMD's RDNA 2 Gets A Codename: “Navi 2X” Comes This Year With 50% Improved Perf-Per-Watt

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While AMD’s Financial Analyst Day is first and foremost focused on the company’s financial performance – it’s right there in the title – this doesn’t stop the company from dropping a nugget or two of technical information along the way, to help excite investors on the future of the company.

One such nugget this year involves AMD’s forthcoming RDNA 2 family of client GPUs. The successor to the current RDNA (1) “Navi” family, RDNA 2 has been on AMD’s roadmap

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AMD's 2020-2022 Client GPU Roadmap: RDNA 3 & Navi 3X On the Horizon With More Perf & Efficiency

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As has become something of a tradition for AMD, this year’s Financial Analyst Day included a high level update to the company’s GPU roadmap. The last roadmap we saw from AMD, unveiled back at the Radeon RX 5700 XT launch last summer, went as far as RDNA 2. Now with RDNA 2 (Navi 2X) set to launch this year, AMD has extended the roadmap to include what’s next. And what’s next is RDNA 3.

The successor to RDNA


AMD Unveils CDNA GPU Architecture: A Dedicated GPU Architecture for Data Centers

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Over the last decade, the industry has seen a boom in demand for GPUs for the data center. Driven in large part by rapid progress in neural networking, deep learning, and all things AI, GPUs have become a critical part of some data center workloads, and their role continues to grow with every year.

Unfortunately for AMD, they’ve largely been bypassed in that boom. The big winner by far as been NVIDIA, who has gone on to make billions of dollars in the field. Which is not

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Intel

AMD Moves From Infinity Fabric to Infinity Architecture: Connecting Everything to Everything

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Another element to AMD’s Financial Analyst Day 2020 was the disclosure of how the company intends to evolve its interconnect strategy with its Infinity Fabric (IF). The plan over the next two generations of products is for the IF to turn into its own architectural design, no longer just between CPU-to-CPU or GPU-to-GPU, and future products will see a near all-to-all integration.

AMD introduced its Infinity Fabric with the first generation of Zen products, which was

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AMD Discusses ‘X3D’ Die Stacking and Packaging for Future Products: Hybrid 2.5D and 3D

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One of AMD’s key messages at its Financial Analyst Day 2020 is that the company wants to remain on the leading edge when it comes to process node technology as well as the latest packaging technology on its newest products. To that end, AMD discussed how it has surged forward with not only 2.5D interposer designs in its GPUs, but also stacked memory and chiplet implementations. The next stage of this journey, according to AMD, is a new X3D die stacking and packaging technology

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Intel

AMD Shipped 260 Million Zen Cores by 2020

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Today’s Financial Analyst Day 2020 from AMD is full of small nuggets of information. With the company  building its foundation on its new x86 Zen high-performance architecture, keeping track of the finances is a good marker to find out how well its products are doing. Another marker is how many chips are in the wild. To that end, AMD's CTO Mark Papermaster presented this graph:

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SSSTC Launches CL1 M.2-2230 SSD: SMI, Up to 512 GB, Up to 2 GB/s

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As notebooks are getting thinner and smaller, PC manufacturers require smaller components and therefore demand tinier SSDs as well as densely-packed SoCs. BGA SSDs are of course among the most compact storage devices around, but modular drives offer flexibility for PC manufacturers as well as end-users. To address this need, in recent years SSD vendors have started to offer M.2-2230 form-factor drives for client computers. This week, Kioxia-owned SSSTC unveiled its new CL1 M.2-