ECS to Unveil LIVA Z3 Plus & LIVA Z3E Plus UCFF PCs at CES: Intel’s 10th Gen Core Inside

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ECS this week disclosed plans to introduce new LIVA ultra-compact form-factor (UCFF) PCs based on Intel’s 10 th Gen Core processors. Set to be fully unveiled at CES next month, the new LIVA Z3 Plus and LIVA Z3E Plus systems are designed to fit in the usual UCFF niches for regular office PCs, media streamers, digital signage players, and industrial applications.

As things stand, ECS’s LIVA Z3 Plus & LIVA Z3E Plus UCFF PCs will be

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Apple Silicon

NVIDIA Details DRIVE AGX Orin: A Herculean Arm Automotive SoC For 2022

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While NVIDIA’s SoC efforts haven’t gone entirely to plan since the company first started on them over a decade ago, NVIDIA has been able to find a niche that works in the automotive field. Backing the company’s powerful DRIVE hardware, these SoCs have become increasingly specialized as the DRIVE platform itself evolves to meet the needs of the slowly maturing market for the brains behind self-driving cars. And now, NVIDIA’s family of automotive SoCs is growing once again, with the formal unveiling of the


ADATA Reveals XPG Hunter SO-DIMMs: Up to DDR4-3000, Up to 32 GB

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ADATA has introduced its new family of SO-DIMMs for laptops and small form-factor desktops. The XPG Hunter DDR4 SO-DIMMs offer data transfer rates of up to 3000 MT/s and capacities from 8 GB to 32 GB, allowing typical dual-channel (dual slot) systems to go up to 64 GB of RAM in total.

ADATA’s XPG Hunter DDR4 SO-DIMMs are based on cherry-picked memory chips as well as high-quality PCBs. Like

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Samsung to Expand 3D NAND Fab in China

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Samsung reportedly plans to invest billions of dollars to expand its 3D NAND production facility in Xian, China. If the company proceeds with the plan, bit production capacity of the fab would increase significantly.

According to Chinese media, the world’s largest supplier of NAND flash memory reportedly intends to spend $8 billion on expansion of its fab in Xian. Back in 2017, Samsung already announced plans to invest $7 billion over the following three years to boost the production capacity of its Xian facility,


Corsair to Acquire SCUF Gaming

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Corsair this week has announced that it will take over SCUF Gaming, a manufacturer of advanced gaming controllers for PCs and consoles. By acquiring SCUF, Corsair not only expands its products portfolio, but also gains further intellectual property and patents related to game controllers. The transaction is projected to be completed by the end of December 2019.

SCUF's controllers are designed to shorten players' hand movements, which in turn is intended to improve their performance. Controllers from SCUF are modular: they feature removable back paddles


OWC Launches ThunderBay 4 Mini DAS: 4 SATA Bays With SoftRAID, Up to 1.5 GB/s

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OWC has introduced a new small form factor high performance, high redundancy DAS for the professional market. The ThunderBay 4 Mini incorporates 4 2.5-inch storage bays, allowing it to store up to 16 TB of data, and with OWC touting transfer speeds of up to 1.5 GB/s. The device is aimed at various creative professionals who need an ample amount of reliable storage space, but in a relatively small package.

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Samsung Unveils Galaxy A51 & Galaxy A71 Mid-Range Smartphones: 6.5/6.7-Inches With 4-Module Cameras

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While Samsung draws most of its smartphone reputation from its high-end phones, the bulk of the phones that the company sells are are not the $700+ Galaxy S series, but rather the cheaper phones that fill out the lower parts of its product stack. To that end, Samsung has unveiled its new mid-range Galaxy A51 and Galaxy A71 smartphones, which are designed to strike a better balance between features and the handset's cost.

As their model numbers suggest, Samsung

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The Snapdragon 865 Performance Preview: Setting the Stage for Flagship Android 2020

Earlier this month we had the pleasure to attend Qualcomm’s Maui launch event of the new Snapdragon 865 and 765 mobile platforms. The new chipsets promise to bring a lot of new upgrades in terms of performance and features, and undoubtedly will be the silicon upon which the vast majority of 2020 flagship devices will base their designs on. We’ve covered the new improvements and changes of the new chipset in our dedicated launch article , so be sure to read that piece if you’


LG Updates Ultralight Gram Laptops & Convertible: Ice Lake Inside

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Along with their flagship 17-inch model , LG this week has also given its 14 and 15.6-inch LG gram laptops an Ice Lake upgrade. The updated machines pair Intel’s Ice Lake processors with up to 24 GB of RAM, all contained within the gram's minimalist, ultra-thin carbon magnesium alloy body, with a total weight of around 1 kilogram. The new LG gram notebooks and convertible will be available next year.

The 2020 LG gram mobile

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Intel

Western Digital Rolls-Out Two New SweRV RISC-V Cores For Microcontrollers

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Western Digital has added two new processor cores — the SweRV Core EH2 and the SweRV Core EL2 — into its SweRV portfolio of microcontroller CPUs. And, keeping in line with past parts, and the company has made their register-transfer level (RTL) design abstraction available to the industry for free. In addition, the company has also introduced the first hardware reference design for OmniXtend cache coherent memory over Ethernet protocol, and transferred management and support of the architecture to Chips Alliance.