Fast memory is crucial for the performance of high-end system-on-chips that are getting more sophisticated every year. When it comes to smartphones, the most obvious way to boost memory performance is to push its data transfer rate. Apparently, this is what Micron and SK Hynix are doing with their new LPDDR5X and LPDDR5T DRAMs that boast a data transfer rate of 9.6 GT/s.

Micron's LPDDR5X-9600 memory devices are made on the company

Apple's release of Arm-based system-on-chips for its desktops and laptops three years ago demonstrated that such processors could offer competitive performance and power consumption. On the Windows-based PC front, only Qualcomm has offered Arm-based SoCs for notebooks in recent years, but it looks like it will soon be joined by AMD and NVIDIA, two notable players in the PC space, according to a Reuters report.

While neither AMD nor NVIDIA has confirmed plans to offer Arm-based SoCs for client PCs

While Qualcomm has become wildly successful in the Arm SoC market for Android smartphones, their efforts to parlay that into success in other markets has eluded them so far. The company has produced several generations of chips for Windows-on-Arm laptops, and while each has incrementally improved on matters, it’s not been enough to dislodge a highly dominant Intel. And while the lack of success of Windows-on-Arm is far from solely being Qualcomm’s fault – there’s a lot to be said for

Thermaltake is a company based in Taiwan that specializes in designing and manufacturing computer hardware components and accessories. Established in 1999, the company's product range includes thermal solutions such as CPU coolers and cases and power supply units, keyboards, and mice. Thermaltake operates globally and has a presence in multiple markets, serving a customer base that ranges from casual computer users to hardware enthusiasts. The company's products are subject to various industry certifications and standards.

Known for its diverse portfolio, ranging from cases and

Samsung’s annual Memory Tech Day is taking place in San Jose this morning, and as part of the event, the company is making a couple of notable memory technology announcements/disclosures. The highlight of Samsung’s event is the introduction of Shinebolt, Samsung’s HBM3E memory that will set new marks for both memory bandwidth and memory capacity for high-end processors. The company is also disclosing a bit more on their GDDR7 memory, which will mark a significant technological update to the GDDR family

Zotac has introduced the industry's first compact PC featuring Frore's AirJet solid-state cooling system. Zotac's ultra-compact Zbox Pico PI430AJ is powered by Intel's Core i3 processor is designed primarily for everyday home and office computing, as well as applications like digital signage.

As far as specifications are concerned, Zotac's Zbox Pico PI430AJ is a fairly sophisticated machine featuring Intel's eight-core Core i3-N300 CPU

Although Taiwan Semiconductor Manufacturing Co. formally started production of chips using its N3 ( 3nm-class ) process technology back in late 2022, the company did not recognize any meaningful N3 revenue in Q1 and Q2. This week as part of the company's Q3 earnings announcement, the foundry finally recognized its first N3-related revenue, with N3 accounting for 6% of TSMC's Q3 revenue. Meanwhile, advanced nodes now account for 59% of

Seagate on Wednesday introduced its Exos X24 family of hard drives, it's highest capacity series of drives to date. The new family is comprised of both conventional magnetic recording technology (CMR) and shingled magnetic recording (SMR) models, with the CMR drive topping out at 24 TB, while SMR brings the peak capacity up to 28 TB. Both are, as of now, the highest-capacity HDDs in their respective segments. But perhaps the most important technological development with the Exos X2

Having just recently crossed the one-year anniversary of AMD’s first Zen 4 architecture CPUs – the Ryzen 7000 series – we’re now at the point where the final Zen 4 products are landing in place. Thus far AMD has launched consumer desktop CPUs, multiple classes of mobile CPUs, and a bevy of server CPUs big (Genoa) and small (Siena). The one remaining gap in AMD’s product roadmap has been the workstation and high-end desktop market, which AMD will

Arm this week introduced its Arm Total Design initiative, which is aimed at accelerating development of custom datacenter-oriented system-on-chip (SoC) designs using Neoverse Compute Subsystems (CSS). The collaborative ecosystem unites various developers in a bid to speed up time-to-market and reduce development costs of custom SoCs for AI, cloud, and high-performance computing markets. ATD promises to enable development of datacenter processors that will offer formidable competition for x86 CPUs.

The Arm Total Design ecosystem is a