Intel and Synopsys Ink Deal to Develop IP for Intel's 3 and 18A Nodes
Intel and Synopsys this week signed an agreement under which Synopsys will develop a portfolio of various IP offerings for Intel 3 and 18A fabrication technologies for Intel Foundry Services (IFS) customers. The availability of industry-standard IP from Synopsys will significantly simplify the development of chips for both current and potential IFS customers. A noteworthy thing about the announcement is that Intel now positions its 3 nm-class node for external clients.
Under this agreement, Synopsys will adapt a variety of its standardized interface IP to Intel's
Samsung, MemVerge, and H3 Build 2TB CXL Memory Pool
Samsung, MemVerge, H3 Platform, and XConn have jointly unveiled their 2 TB Pooled CXL Memory System at the Flash Memory Summit. The device can be connected to up to eight hosts, allowing them to use its memory when needed. The 2 TB Pooled CXL Memory system has software enabling it to visualize, pool, tier, and dynamically allocate memory to connected hosts.
The 2 TB Pooled CXL Memory system is a 2U rack-mountable machine built by H3 with eight 256 GB Samsung CXL memory
SK Hynix Launches 24GB LPDDR5X-8500 Stacks for Smartphones, PCs, and HPC
On Friday, SK Hynix said it had started mass production of 24 GB LPDDR5X memory stacks that can be used for ultra-high-end smartphones and PCs. The company's LPDDR5X-8500 devices combine ultra-high-performance with high density, thus enabling fast systems with sufficient memory capacity. SK Hynix says such modules could be used well beyond smartphones, PCs, and even servers.
SK Hynix's 24 GB LPDDR5X package features an 850
Samsung Teases 256 TB SSD: 3D QLC NAND at Its Best
Samsung teased the industry's first 256 TB solid-state drive at the Flash Memory Summit 2023. The new drive features unprecedented storage density and is aimed primarily at hyper-scale data centers where storage density and reduced power consumption matter the most.
Samsung's 256 TB SSD is based on 3D QLC NAND memory and probably uses innovative packaging to cram multiple 3D QLC NAND devices into stacks. The company does not disclose which form factor the drive uses. Still, because
Memory Makers on Track to Double HBM Output in 2023
TrendForce projects a remarkable 105% increase in annual bit shipments of high-bandwidth memory (HBM) this year. This boost comes in response to soaring demands from AI and high-performance computing processor developers, notably Nvidia, and cloud service providers (CSPs). To fulfill demand, Micron, Samsung, and SK Hynix are reportedly increasing their HBM capacities, but new production lines will likely start operations only in Q2 2022.
More HBM Is Needed
Memory makers managed to more or less match
Silicon Motion Readies PCIe Gen5 SSDs with 3.5W Power Consumption
Virtually all PCIe Gen5 SSDs released to date are relatively power-hungry and require a massive cooling system, effectively preventing their installation into compact desktops and notebooks. But Silicon Motion's next-generation SM2508 SSD platform promises to change that and enable ultra-high-performance drives with a PCIe 5.0 interface and power consumption as low as 3.5W. The company is showcasing prototypes of its PCIe Gen5 client drives at the Flash Memory Summit 2023.
The Silicon
SK Hynix Shows Off 321-Layer 3D TLC NAND Device
SK Hynix showcased its 321-layer TLC NAND memory at the Flash Memory Summit 2023. The South Korean company is the first NAND maker to publicly demonstrate 3D NAND with over 300 layers. Although such memory is expected in mass production in 2025, the demonstration is meant to showcase SK Hynix's preparedness for the next wave of non-volatile memory technology.
This showcased 321-layer 3D NAND memory device boasts a 1 Tb (128
Micron's CZ120 CXL Memory Expansion Modules Unveiled: 128GB and 256GB
This week, Micron announced the sample availability of its first CXL 2.0 memory expansion modules for servers that promise easy and cheap DRAM subsystem expansions.
Modern server platforms from AMD and Intel boast formidable 12- and 8-channel DDR5 memory subsystems offering bandwidth of up to 460.8 – 370.2 GB/s and capacities of up to 6 – 4 TB per socket. But some applications consume all DRAM they can get and demand more. To satisfy the needs of such applications
NVIDIA Completes ProViz Ada Lovelace Lineup with Three New Graphics Cards
When NVIDIA began to roll out their Ada Lovelace architecture to the workstation market, the company introduced its new flagship RTX 6000 Ada graphics card meant to offer the highest performance possible as well as its quite spectacular RTX 4000 SFF board that delivers formidable performance in a tiny package. The gap between the two solutions is vast, and on Tuesday, the company finally unveiled new products that fill it.
NVIDIA's Ada Lovelace-based RTX-series professional graphics cards — the workstation-oriented RTX
NVIDIA Unveils GH200 'Grace Hopper' GPU with HBM3e Memory
At SIGGRAPH in Los Angeles, NVIDIA unveiled a new variant of their GH200' superchip,' which is set to be the world's first GPU chip to be equipped with HBM3e memory. Designed to crunch the world's most complex generative AI workloads, the NVIDIA GH200 platform is designed to push the envelope of accelerated computing. Pooling their strengths in both the GPU space and growing efforts in the CPU space, NVIDIA is looking to deliver a semi-integrated design to conquer