Micron Publishes Updated DRAM Roadmap: 32 Gb DDR5 DRAMs, GDDR7, HBMNext
In addition to unveiling its first HBM3 memory products yesterday , Micron also published a fresh DRAM roadmap for its AI customers for the coming years. Being one of the world's largest memory manufacturers, Micron has a lot of interesting things planned, including high-capacity DDR5 memory devices and modules, GDDR7 chips for graphics cards and other bandwidth-hungry devices, as well as HBMNext for artificial intelligence and high-performance computing applications.
Rapidus Wants to Supply 2nm Chips to Tech Giants, Challenge TSMC
It has been a couple of decades since a Japanese fab has offered a leading-edge chip manufacturing process. Even to this day, none of the Japanese chipmakers have made it as far as adopting FinFETs, something that U.S. and Taiwanese companies adopted in early-to-mid-2010s. But Rapidus, a semiconductor consortium backed by the Japanese government and large conglomerates, plans to leapfrog several generations of nodes and start 2nm production in 2027. Interestingly, the company
Micron Unveils HBM3 Gen2 Memory: 1.2 TB/sec Memory Stacks For HPC and AI Processors
Micron today is introducing its first HBM3 memory products, becoming the latest of the major memory manufacturers to start building the high bandwidth memory that's widely used in server-grade GPUs and other high-end processors. Aiming to make up for lost time against its Korean rivals, Micron intends to essentially skip "vanilla" HBM3 and move straight on to even higher bandwidth versions of the memory they're dubbing "HBM3 Gen2", developing 24 GB stacks that run at over 9 GigaTransfers-
The Be Quiet! Dark Power Pro 13 1300W ATX 3.0 PSU Review: Flagship Quality, Flagship Price
Having reviewed and dissected almost a dozen ATX 3.0 power supplies in the last year, thus far we've seen an interesting mix in design pedigrees for PSUs targeting the newest power standard. For some manufacturers this has meant bringing up entirely new PSU designs by OEMs new and old, developing fresh platforms to accommodate the new 12VHPWR connector and its up to 600 Watt power limits. Meanwhile for other manufacturers, especially at the high end of the market, their existing PSU designs are so bulletproof that
TACC's Stampede3 Supercomputer Uses Intel's Xeon Max with HBM2E and Ponte Vecchio
The Texas Advanced Computing Center (TACC) unveiled its latest Stampede supercomputer for open science research projects, Stampede3. TACC anticipates that Stampede3 will come online this fall and will deliver its full performance in early 2024. The supercomputer will be a crucial component of the U.S. National Science Foundation’s (NSF) ACCESS scientific supercomputing ecosystem, and it is projected to serve the open science community from 2024 until 2029.
The third-generation Stampede cluster, which
Intel Unveils AVX10 and APX Instruction Sets: Unifying AVX-512 For Hybrid Architectures
Intel has announced two new x86-64 instruction sets designed to bolster and offer more performance in AVX-based workloads with their hybrid architecture of performance (P) and efficiency (E) cores. The first of Intel's announcements is their latest Intel Advanced Performance Extensions, or Intel APX as it's known. It is designed to bring generational, instruction set-driven improvements to load, store and compare instructions without impacting power consumption or the overall silicon die area of the CPU cores.
Crucial X9 Pro and X10 Pro High-Performance Portable SSDs Announced
Crucial's X6 and X8 Portable SSDs have been attractive budget options for the mainstream consumers looking to purchase high-capacity direct-attached storage drives. The company has been delivering some industry-firsts in these drives. However, these drives use QLC and are not particularly attractive for power users (such as content creators) who require writing vast amounts of data as quickly as possible.
TSMC to Build $2.87 Billion Facility For Advanced Chip Packaging
TSMC on Tuesday announced plans to construct a new advanced chip packaging facility in Tongluo Science Park. The company intends to spend around $2.87 billion on the fab that will employ some 1,500 people when it becomes operational several years from now.
"To meet market needs, TSMC is planning to establish an advanced packaging fab in the Tongluo Science Park," a statement by TSMC reads. "TSMC expects to invest nearly NT$90 billion for the project, and create 1,5
Cadence Buys Memory and SerDes PHY Assets from Rambus
In a surprising turn of events, Cadence and Rambus entered into a definitive agreement late last week for Cadence to buy memory physical interface IP and SerDes businesses from Rambus. As a result, Cadence will get a comprehensive portfolio of memory PHY IP and an established client base. Meanwhile, with the sale of its PHY and SerDes assets, Rambus will now solely focus on licensing digital IP.
Historically, Rambus developed memory technologies, including RDRAM and XDR DRAM. At some point, the company patented fundamental technologies enabling SDRAM, DDR
AMD Launches Ryzen 5 7500F in China: Zen 4 With no Integrated Graphics
Over the weekend, AMD officially listed the Ryzen 5 7500F processor on their website. Although initial reports pointed towards a China-only release, and at present, that much is true, the Ryzen 5 7500F is heading towards global availability, at least according to AMD. With a reported MSRP of around $179, the Ryzen 5 7500F is currently the cheapest Zen 4-based desktop processor. It comes with six Zen 4 cores and is similar