TSMC: 3nm Chips for Smartphones and HPCs Coming This Year
While TSMC formally started mass production of chips on its N3 ( 3nm-class ) process technology late last year, the company is set to finally ship the first revenue wafers in the current quarter. During the most recent earnings call with analysts and investors, the company said that demand for 3 nm products was steady, and that numerous designs for smartphones and high-performance applications are incoming later this year. Furthermore, N3E manufacturing node is on track for high-volume manufacturing later this year.
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Ultra Ethernet Consortium Formed, Plans to Adapt Ethernet for AI and HPC Needs
This week the Linux Foundation has announced that the group will be overseeing the formation of a new Ethernet consortium, with a focus on adapting and refining the technology for high performance computing workloads. Backed by founding members AMD, Arista, Broadcom, Cisco, Eviden, HPE, Intel, Meta and Microsoft, the new Ultra Ethernet Consortium will be working to improve Ethernet to meet the low latency and scalability requirements that HPC and AI systems need – and which the group says current Ethernet technology isn't quite up to the task
Cerebras to Enable 'Condor Galaxy' Network of AI Supercomputers: 36 ExaFLOPS for AI
Cerebras Systems and G42, a tech holding group, have unveiled their Condor Galaxy project, a network of nine interlinked supercomputers for AI model training with aggregated performance of 36 FP16 ExaFLOPs. The first supercomputer, named Condor Galaxy 1 (CG-1), boasts 4 ExaFLOPs of FP16 performance and 54 million cores. CG-2 and CG-3 will be located in the U.S. and will follow in 2024. The remaining systems will be located across
Solidigm Announces D5-P5336: 64 TB-Class Data Center SSD Sets NVMe Capacity Records
Advancements in flash technology have come as a boon to data centers. Increasing layer counts coupled with better vendor confidence in triple-level (TLC) and quad-level cells (QLC) have contributed to top-line SSD capacities essentially doubling every few years. Data centers looking to optimize storage capacity on a per-rack basis are finding these top-tier SSDs to be an economically prudent investment from a TCO perspective.
Solidigm was one of the first vendors to introduce a 32 TB-class enterprise SSD a few
TSMC Delays Arizona Fab Deployment to 2025, Citing Shortage of Skilled Workers
TSMC on Thursday disclosed that it will have to delay mass production at its Fab 21 in Arizona to 2025, as a lack of suitably skilled workers is slowing down the installation of cleanroom tools. The company also confirmed that it is sending in hundreds of people familiar with its fabs from Taiwan to Arizona to assist the installation.
"We are encountering certain challenges, as there is an insufficient amount of skilled workers with the specialized expertise required for equipment installation in a semiconductor-grade facility," said Mark
ASUS Signs Agreement to Continue Development and Support of Intel's NUC Business
ASUS and Intel late on Tuesday announced that they had agreed to a term sheet involving Intel's NUC business, ensuring the continued support of existing NUC hardware as well as the development of new designs. Under the terms of the deal, ASUS will receive a non-exclusive license to existing Intel's NUC systems designs, the right to develop future designs, and an obligation to support existing NUCs. The world's largest motherboard supplier and one of the top 10 PC makers will thus take over a significant
Samsung Completes Initial GDDR7 Development: First Parts to Reach Up to 32Gbps/pin
Samsung has announced this evening that they have completed development on their first generation of GDDR7 memory. The next iteration of the high bandwidth memory technology, which has been under industry-wide development, is expected to hit the market in 2024, with Samsung in prime position to be one of the first memory vendors out of the gate. With their first generation of GDDR7 parts slated to hit up to 32Gbps/pin of bandwidth – 33% more than their best GDDR6 parts today
Logitech Acquires Loupedeck to Enhance Its Software Roadmap
Being a significant maker of peripherals in general and gaming peripherals in particular, Logitech cannot omit the content creators and streamers market, which is now virtually dominated by Corsair's Elgato. On Tuesday, Logitech said that it had acquired Loupedeck, a streaming controller specialist, enabling the company to address streamers with a dedicated product. Furthermore, the company plans to use Loupedeck's expertise beyond its controllers.
Streaming controllers is a dynamically developing and lucrative market. These controllers retail sold for $199 - $49
ASRock Industrial NUC BOX-1360P/D5 Review: Raptor Lake-P on the Leading Edge
ASRock Industrial has been a key player in the ultra-compact form-factor PC space over the last few years. They have managed to release 4"x4" systems based on the latest AMD and Intel platforms well ahead of other vendors. The company's NUC BOX-1300 series was launched along with Intel's introduction of Raptor Lake-P in January 2023. The NUCS BOX-1360P/D4 was made available in early February with minimal
Samsung Foundry's 3nm and 4nm Yields Are Improving - Report
Currently, only two foundries offer their customers 3 nm and 4 nm-class process technologies: TSMC and Samsung Foundry. But business media sometimes blames Samsung Foundry for mediocre yields on leading-edge nodes, which cannot be verified. But a recent report issued by an investment banking firm claims that yields of Samsung's 3 nm and 4 nm-class nodes are on quite decent levels. But there is a catch.
Samsung Foundry's 4 nm-class process technology yield is now higher than 75%.