At long last the date is here. AMD this evening will be broadcasting their "together we advance_PCs” event, which will be focused around the upcoming launch of their next-generation Ryzen 7000 processors.

AMD first unveiled their Ryzen 7000 platform and branding back at Computex 2022, offering quite a few high-level details on the forthcoming consumer processor platform while stating it would be launching in the fall. The new CPU family will feature up to 16 Zen 4

Today we are having a look at the new XG Plus Platinum series, the latest power supply family from prolific PC peripherals producer Cooler Master. Designed to offer a quality PSU with an extra dash of flair, the RGB fan (and RGB display) equipped XG Plus Platinum is a PSU that's not quite like anything else on the market. The XG family ranges from 650 to 850 Watts, and today we're evaluating the most powerful unit in the series, the 850W

Intel this week introduced its new Semiconductor Co-Investment Program (SCIP) under which it will build new manufacturing facilities in collaboration with investment partners – a sharp departure from the company's traditional stance of wholly owning its logic fabs. As part of its SCIP initiative, Intel has already signed a deal with Brookfield Asset Management, which will provide Intel about $15 billion to build its fab new fab in Arizona in exchange for a 49% stake in the project. Furthermore, similar co-investment models are

Over the years, multiple motherboards have captivated the market at various price points. Models like the Hero and the Formula are staples of ASUS's premium but popular ROG-themed offerings. One such series that was once the staple of ASUS's Intel models based on the micro-ATX form factor was the Gene, last seen in the days of Intel's 8th and 9th Gen Core series (2019). In what looks to be a resurrection of the Gene series for the release

Samsung on Friday broke ground for a new semiconductor research and development complex which will design new fabrication processes for memory and logic, as well as conduct fundamental research of next-generation technologies and materials. The company plans to invest KRW 20 trillion ($15 billion) in the new R&D facility by 2028.

To make more competitive logic and memory chips, companies like Samsung have to innovate across many directions, which includes new materials (for fins, for gates, for contacts, for

In a brief press release sent out this morning, AMD has announced that they will be delivering their eagerly anticipated Ryzen 7000 unveiling later this month as a live stream. In an event dubbed “together we advance_PCs”, AMD will be discussing the forthcoming Ryzen 7000 series processors as well as the underlying Zen 4 architecture and associated AM5 platform – laying the groundwork ahead of AMD’s planned fall launch for the Ryzen 7000 platform. The event is set to kick

Today, we are taking a look at the updated version of the Alphacool Eisbaer AIO CPU cooler, the Eisbaer Aurora. For its second-generation product, Alphacool has gone through the Eisbaer design and improved every single part of this cooler, from the pump to the radiator and everything in-between. Combined with its unique, modular design that allows for additional blocks to be attached to this otherwise closed loop cooler, and Alphacool has a unique and powerful CPU cooler on its hands – albeit one that carries a price premium

The past few years have seen Intel and AMD delivering new processors in a staggered manner. In the sub-45W category, Intel's incumbency has allowed it to deliver products for both the notebook and ultra-compact form factor (UCFF) within a few months of each other. On the other hand, AMD's focus has been on the high-margin notebook market, with the chips filtering down to the desktop market a year or so down the road. In this context, AMD's

Among the groups with a presence at this year’s Flash Memory Summit is the UCIe Consortium, the recently formed group responsible for the Universal Chiplet Interconnect Express (UCIe) standard . First unveiled back in March, the UCIe Consortium is looking to establish a universal standard for connecting chiplets in future chip designs, allowing chip builders to mix-and-match chiplets from different companies. At the time of the March announcement, the group was looking for additional members as it prepared to formally incorporate, and for FMS they’

As the 2022 Flash Memory Summit continues, SK hynix is the latest vendor to announce their next generation of NAND flash memory at the show. Showcasing for the first time the company’s forthcoming 238 layer TLC NAND, which promises both improved density/capacity and improved bandwidth. At 238 layers, SK hynix has, at least for the moment, secured bragging rights for the greatest number of layers in a TLC NAND die – though with mass production not set to begin until 20