SK hynix has announced iHBM, a new thermal design for future High Bandwidth Memory products

The company says the solution embeds integrated cooling elements, or ICEs, inside the HBM package. These elements are made from an electrically non-conductive silicon-based material and add another thermal path inside the package.
SK hynix says iHBM targets the Die-to-Die Physical Layer area, also known as D2D PHY. This is the interface between the HBM base die and the AI accelerator, and according to the company,








