AMD's innovative chiplet-based Zen microarchitecture allows the company to tie together several die into single multi-chip modules (MCM) like the Ryzen and EPYC processors, but the company isn't stopping there: Today at its Financial Analyst Day 2020 the company unveiled its new X3D chip packaging technology that will bring its MCMs into the third dimension and provide up to an 10X improvement in bandwidth density.
The new technology is a combination of 2.









