The Tensor G4 will likely be Google’s final chipset fabricated by Samsung, as the company looks to extend its business ties with TSMC to allow its Pixel range of smartphones and tablets to better compete with its rivals. According to the latest report, some Mountain View executives recently visited Taiwan, with the possibility that the partnership between the two firms will last between 3 and 5 years. Later this year, we should bear witness to the first product that will materialize as a result of the Google-TSMC tag-
谷歌與台積電達成協議：生產Pixel系列智能手機使用的Tensor芯片，或持續五年
去年就傳出2025年穀歌將改變策略，在用於Pixel 10系列的Tensor G5上更換代工廠，從三星變成了台積電（TSMC），傳聞將採用第二代3nm工藝製造，以便讓旗下的智能手機和平板電腦更好地與對手競爭。
據DigiTimes 報道 ，最近谷歌的高
索尼推進新款PlayStation掌機項目：AMD定製SoC或採用三星SF2P工藝
去年就有報道稱，索尼可能選擇重新進入掌機市場，正在開發新款PlayStation掌機，首發遊戲陣容是PlayStation 4的遊戲。其採用了AMD的定製SoC，大概會與下一代遊戲主機PlayStation 6一同出現。
據Wccftech 報道 ，近日有消息稱，索尼正在評估一個新的低功耗遊
Intel Announces Entry-Level “Core Ultra 200” Workstation Desktop And Laptop CPUs
Intel has unveiled a wide range of entry-level workstation solutions for consumers, featuring the Intel Arrow Lake "Core Ultra 200" CPUs.
Intel Debuts Affordable Workstations Based on Arrow Lake "Core Ultra 200" CPUs: Claims Superior Performance Compared to Its Rivals
The Intel client segment received entry-level workstation systems for consumers, which will offer competitive performance on a budget. Intel has announced both desktop and laptop workstations, equipped with the latest Intel Core Ultra processors, offering noticeable performance uplifts over its rival
Xiaomi’s XRING 01 Does Not Mean It Will Immediately Cut Off Sourcing From Qualcomm & MediaTek, As An Estimate Reveals That 40 Percent Of The Company’s Smartphones Use ‘Off The Shelf’ Parts
The arrival of the XRING 01 is a message from Xiaomi that it is fully prepared and equipped to design and manufacture custom chipsets, securing a new milestone by becoming the first Chinese firm to successfully commercialize a 3nm SoC. While the new silicon’s launch would indicate that the company is ready to wave goodbye to its partners Qualcomm and MediaTek, a new estimate reveals that it may take several years before Xiaomi is completely self-sufficient in making its own chipsets. For now, around 40 percent of the
Apple Was Apparently Testing Its M3 Ultra With Its Newer MacBook Pro Models, With One User Finding Evidence In An iOS 18 Internal Build Related To Those Unreleased Versions
The 14-inch and 16-inch MacBook Pro models can be kitted out with Apple’s M4 Max as their most powerful configuration, with the M3 Ultra reserved for the significantly more powerful Mac Studio. From the beginning, it was always apparent that thermal constraints prevented the Cupertino giant from using a chipset with the ‘Ultra’ moniker. However, one possibility existed where Apple might have introduced its workstation-class chipset to its portable Macs, as the technology giant was said to be testing out
ASRock launches new AMD motherboards at Computex 2025
ASRock just unveiled its new motherboard lineup at Computex 2025 , showing off the latest versions of its flagship Taichi OCF and Taichi Creator AM5. It also has several mid-range and entry-level models on display, ensuring that it has a solution for everyone, no matter what their needs and budget are. What’s interesting, though, is that there weren’t any new Intel motherboards at ASRock’s booth.
This was unlike last year
小米玄戒系列芯片亮相，包含高性能SoC玄戒O1和低功耗的玄戒T1
昨晚小米召開了15週年戰略新品發佈會，發佈了包括手機、平板和汽車在內的多款重磅產品。其中，小米15S Pro、小米Pad 7 Ultra和小米Watch S4都有一個共同的亮點，那就是搭載了小米的玄戒系列SoC。説起來小米上一次做手機SoC
Xiaomi’s XRING 01 Has The Smallest Die Size For Any Current-Generation 3nm Chipset, Barely Beating Apple’s A18 Pro With Its 109mm² Dimensions; Dimensity 9400 The Largest SoC
The choice to stick with TSMC’s second-generation 3nm process, also known as N3E, for the XRING 01 has allowed Xiaomi to cram in 19 billion transistors while also maintaining a smaller die size, making it an impressive feat when it comes to chip engineering. However, if we compare the latest SoC with the competition that utilizes the same lithography, Xiaomi’s latest solution is smaller than the A18 Pro, Dimensity 9400, and the Snapdragon 8 Elite.