Apple Silicon|Intel

Xiaomi founder flexes chip prowess as new XRing O1 bests Apple’s A18 Pro in certain tests

The XRing O1 marks a breakthrough for Xiaomi in advanced chip design after the firm made its mark in the electric vehicle and smartphone sectors. Photo: Handout

Xiaomi on Thursday unveiled its new XRing O1 integrated circuit (IC) – designed to power the company’s next-generation smartphones and tablets – that it claims bested the performance of Apple ’s latest A18 Pro chip in certain benchmark tests.
“I have confidence to say that the XRing O1 is very strong,” Xiaomi founder

Apple Silicon|Intel

Xiaomi’s XRING 01 Goes Official As Company’s First Custom 3nm SoC With 19 Billion Transistors, 10-Core Cluster, LPDDR5T Support, And A Host Of Other Impressive Specifications

Setting a new milestone in the silicon race is Xiaomi’s XRING 01, which has been officially announced today, and is the company’s first 3nm chipset that competes with the Snapdragon 8 Elite, Dimensity 9400, Dimensity 9400+, Apple’s A19, and A19 Pro. The Chinese firm has now laid out all the details, providing the necessary specifications of its latest chipset, so let us dive into the launch immediately.

GPU configuration of XRING


Apple Silicon|Intel

Corsair Showcases Innovative PC Hardware And Peripherals At Computex; Powerboard Takes The Limelight

From blazing-fast SSDs to innovative PC cases, Corsair showed some fantastic offerings at the Computex event.

Corsair Unveils PCI-E 5.0 SSDs, High-Performance RAM, Refreshed PSU Lineup, Hydro X Cooling Solutions, Cases, and New Peripherals

Corsair had some really creative products for the consumer PC segment at Computex. The company not only showcased newer lineups for components and peripherals but also brought some convenient stuff that we hadn't ever seen before.

Starting with the PC components, Corsair introduced new PCI-


Apple Silicon|Intel

(PR) Xsight Labs Announced Availability of Its Arm-Based E1-SoC for Cloud and Edge AI Data Centers

Xsight Labs, a leading fabless semiconductor company providing end-to-end connectivity for next-generation hyperscale, edge and AI data center networks, today announced availability of its Arm -based E1-SoC for cloud and edge AI data centers. The E-Series is the only product of its kind to provide full control plane and data path programmability and is the industry's highest performance software-defined DPU (Data Processing Unit). Xsight Labs is taking orders now for its E1-SoC and the
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Apple Silicon|Intel

GIGABYTE Shows Its X870E/X870 AORUS Series Motherboards for AMD Ryzen CPUs at Computex 2025

GIGABYTE has on display at Computex 2025 its latest motherboards from the AORUS series, built around AMD X870E and X870 chipsets. Starting with the X870E AORUS Master X3D Ice motherboard, winner of the TechPowerUp Best of Computex 2025 Award for product innovation and design, GIGABYTE also showcases the X870M AORUS ELITE WIFI7, X870E AORUS ELITE X3D ICE, X870E AORUS PRO
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Apple Silicon

ASRock Displays Its New Taichi OCF and Creator, and Phantom Gaming X870E/X870 Motherboards

In addition to new graphics cards, ASRock also showcased a couple of new motherboards at the Computex 2025 show in Taipei, including the new X870E Taichi OCF, X870 Taichi Creator, as well as the new Phantom Gaming X870 Nova Wi-Fi motherboard.

The star of the show is the new X870E Taichi OCF, which is also the first OC Formula motherboard based on AMD platform. This feature packed motherboard will support AMD Ryzen 90
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Apple Silicon

為何台積電不接華為訂單卻為小米代工 中國媒體分析背後原因

小米玄戒 O1 晶片採用台積電第二代 3nm 工藝引發熱議,同樣是中國自研晶片,華為海思卻在五年前遭受徹底斷供。中國媒體分析指出,台積電對小米與華為「差別待遇」背後,隱藏美國技術霸權與地緣政治算計,關鍵在於晶片


Apple Silicon|Intel

MSI Unleashes MEG X870E ACE & B850MPOWER Motherboards, Two AM5 ITX Designs & MAG X870E Tomahawk WIFI PZ With Backside Connectors

MSI launched a barrage of AMD AM5 motherboards with its MEG X870E ACE & B850MPOWER being the showcase highlights alongside a trio of ITX offerings.

MSI Gives AMD AM5 Builders Even More Motherboard Options, MEG X870E ACE For Enthusiasts, B850MPOWER For Overclockers, Mini-ITX Designs & Backside Connector Tomahawk

A common trend that we are seeing at Computex is that most motherboard manufacturers are putting more effort in their AM5 lineup rather than the Intel side


Apple Silicon

Xiaomi Has Also Resorted To Chip-Binning For The XRING 01, Uses A Slightly Downgraded Version With Reduced Clock Speeds For Its Flagship Tablet, The Pad 7 Ultra

The XRING 01 will make its debut in the upcoming Pad 7 Ultra on May 22 , marking the first time that Xiaomi will ever use an in-house silicon in a flagship tablet. However, the custom chipset will be slightly different in this area because a leaked benchmark reveals that the Chinese firm is taking the same approach as Apple, which is relying on chip-binning to introduce not one, but two versions of the XRING 01. The changes include a downgrade in the clock speeds, but thankfully


Apple Silicon|Intel

ASRock X870E Taichi OCF With 25 110A VRM Design Unleashed, X870 Taichi Creator & Nova Also Land

ASRock is several new motherboards at Computex in the AMD AM5 family with the X870E Taichi OCF taking the spotlight at their booth.

ASRock Brings Taichi OCF To AMD AM5 Ecosystem With X870E Taichi OCF, Packs 25 VRM Design With 110A SPS Stages & Extreme DDR5 Overclocking Support

ASRock's Taichi OCF series are some of the fastest and most beloved motherboards for overclocking. These boards have so far only been available on Intel platforms, but this year, ASRock