Apple Silicon|Intel

Intel accidentally leaks monstrous 9,324-pin socket for "Diamond Rapids" Xeon CPUs

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In a nutshell: Intel has accidentally spilled some beans on its next-next-gen server processors. Code-named Diamond Rapids, these upcoming Xeon CPUs will slot into the company's Oak Stream platform – and if the leaked details are accurate, they're going to be an absolute unit.

The Xeon leak originated from Intel's own website, where the company briefly posted information about a $90


Apple Silicon

Apple is ready for September launch of iPhone 16, new wearables, and new Airpods

Serving tech enthusiasts for over 25 years.
TechSpot means tech analysis and advice you can trust .

Highly anticipated: As Apple prepares for its big annual iPhone launch, it faces a rapidly evolving market marked by a 6.5% growth in global smartphone shipments in the second quarter of 2024. Meanwhile, the wearables market is becoming increasingly price-sensitive, with consumers favoring more affordable options. The integration of AI capabilities could be pivotal in attracting new buyers, particularly Gen Z and Millennials, who are

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Apple Silicon|Intel

Qualcomm's slowest Snapdragon X Plus CPU quietly sneaks into the market — X1P-42-100 features eight cores up to 3.4 GHz, 1.7 TFLOPS GPU, and 45 TOPS NPU

Snapdragon X Plus (Image credit: Qualcomm)

Qualcomm and its partners have quietly started shipping systems based on the company's entry-level Snapdragon X Plus X1P-42-100 processor. The CPU is not only the cheapest in the Snapdragon X lineup yet, but it also happens to support device TDP of up to 20W, making it Qualcomm's lowest-power PC processor. However, that lower power comes with significant performance tradeoffs, as reported by VideoCardz .

While Qualcomm

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Apple Silicon|Intel

Qualcomm introduces 8-core Snapdragon X Plus “X1P-42-100” SKU with 1.7 TFLOPS GPU

Cheaper laptops to get 8-core Snapdragon SKU

The company confirms leaks about the X1P-42-100 SKU.

Recently, Qualcomm CEO Cristiano Amon announced that the goal for the Snapdragon X series is to reach sub-$700 pricing by 2025. So far, the company has made little effort to lower the prices of their first-generation AI laptops powered by Oryon architecture, most of which are still overpriced for what they offer.

However, these laptops are already

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Apple Silicon

Samsung to tape out first HBM4 devices later this year, sampling begins in 2025: Report

(Image credit: AMD)

Samsung is set to tape out its first HBM4 memory devices later this year with sampling set to begin in early 2025, reports nN Elec citing industry sources. The company is projected to use its latest-generation 10nm-class DRAM fabrication process to make HBM4 DRAM devices as well as its 4nm-class logic technology to produce HBM4 base dies, the report says.

After Samsung tapes out its first HBM4 memory devices and base dies, its

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Apple Silicon|Intel

(PR) IBASE Launches MI1002 Mini-ITX Board Powered by Intel Core Ultra Processors

IBASE Technology Inc., a leading innovator of embedded computing solutions, announces the launch of the MI1002 Mini-ITX motherboard powered by the latest Intel Core Ultra processors Series 1 (Meteor Lake-PS platform) with an LGA1851 socket. The new platform provides advanced AI capabilities, enhanced graphics, and remarkable energy efficiency, enabling the MI1002 to handle complex tasks effortlessly, whether deploying AI applications, managing edge computing, or driving IoT solutions.

The MI10
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Apple Silicon|Intel

Intel's Diamond Rapids will use LGA9324 packaging

(Image credit: Intel)

Intel's Xeon Diamond Rapids processors will use the company's all-new Oak Stream platform, which will adopt a brand-new socket with over 9300 pins, based on a test tool that Intel currently offers to its partners (discovered by @harukaze5719 ).

The new LGA9324 socket for Intel's Xeon 7 'Diamond Rapids' processors will — as the name suggests — have 9,324 contacts. This

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Apple Silicon

xMEMS Labs announces first all-silicon active fan-on-a-chip for mobile devices

(Image credit: xMEMS Lab)

The leading provider of solid-state micro-speaker technology, xMEMS Labs, has announced the first all-silicon active micro-cooling fan-on-a-chip for use with mobile devices. The innovative technology will allow manufacturers to integrate active cooling into their smartphones, tablets, and other advanced mobile devices without sacrificing size.

Since manufacturers are constantly trying to reduce the size of our mobile devices, space inside the case is always at a premium. On the other hand,

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Apple Silicon

Linux Support Emerging For The Samsung Galaxy Book4 Edge X1 Elite Laptop

Following all of the Snapdragon X1 upstream enablement work over the past number of months by Qualcomm and then DeviceTree additions emerging for enabling the likes of the ASUS Vivobook S 15 , Lenovo Yoga Slim 7x , Lenovo ThinkPad T14s Gen 6 , and Microsoft Surface 7 , the Samsung Galaxy Book4 Edge is the newest Snapdragon X1 Elite laptop seeing Linux DT support.

DTS patches have been posted for review for getting the Samsung Galaxy Book4 Edge laptop booting on a mainline Linux kernel. The laptop'
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Apple Silicon|Intel

(PR) xMEMS Introduces 1mm-Thin Active Micro-Cooling Fan on a Chip

xMEMS Labs, developers of the foremost platform for piezoMEMS innovation and creators of the world's leading all-silicon micro speakers, today announced its latest industry-changing innovation: the xMEMS XMC-2400 µCooling chip, the first-ever all-silicon, active micro-cooling fan for ultramobile devices and next-generation artificial intelligence (AI) solutions.

For the first time, with active, fan-based micro-cooling (µCooling) at the chip level, manufacturers can integrate active
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