Huawei's next-generation Kirin chip will reportedly use a unified memory architecture (UMA), much like the Apple M-series silicon and Intel Core Ultra Series CPUs. It means that Huawei will bake in the RAM on the next-generation Kirin processors and make it available to the GPU and CPU. Weibo user Fixed Focus Digital (machine translated from Chinese), who also predicted that the Kirin CPU with Taishan V130 cores could match Apple M3 performance, said
Intel "Meteor Lake" CPUs Face Yield Issues, Company Running "Hot Lots" to Satisfy Demand

(PR) AAEON Unveils PICO-MTU4 SBC Powered by Core Ultra "Meteor Lake" Processors

Qualcomm's Snapdragon 4s Gen 2 SoC is designed for cheap phones with a 5G twist

TL;DR: Recent mobile platforms introduced by Qualcomm have largely focused on the high-end segment of the smartphone market. The fabless chip manufacturer is now releasing another SoC specifically designed for more affordable devices, although the company still aims to market it with "premium" features, including AI.
Qualcomm's new Snapdragon 4s Gen 2 mobile chip aims to reshape how the world, or
Intel wins patent spat with R2 Semiconductor in the UK — chipmaker still has ongoing cases in Germany, Italy, and France

In the High Court of England and Wales, Intel just won the case R2 Semiconductor filed against it. R2 alleges that Intel’s voltage regulation technology infringes on a patent it owns and wants to stop the sale of Intel processors that use it.
This technology is designed to protect the chip from damage or degradation in case of overvoltage, and Intel uses it for its 10th to 12th-generation Intel Core processors. R2 Semiconductor says that Intel is violating
512-core AmpereOne Aurora processor with custom AI engine and HBM memory support announced

TechSpot means tech analysis and advice you can trust .
What just happened? Ampere Computing has announced that it is developing an integrated AI accelerator designed to address the growing demands of cloud-native AI computing. Called the AmpereOne Aurora, the new chip is said to offer high efficiency and can be deployed in all existing data centers.
The AmpereOne Aurora is a 512-core Arm processor with on-chip High Bandwidth Memory (HBM), designed for AI training and
$700 Snapdragon X PCs will be available starting next year, says Qualcomm CEO

Qualcomm CEO Cristiano Amon said during the company’s 3Q24 earnings call that the company will launch $700 Snapdragon X PCs by next year. This is exciting news for those looking for budget options, as the most affordable Snapdragon X laptop right now is the $999 Microsoft Surface Pro or Microsoft Surface laptop.
“As we look forward to 2025, in addition to new design wins, our X series product roadmap will expand
AM4 Lives On! AMD has released new Ryzen 5000XT CPUs
AMD has released their new Ryzen 7 5800XT and Ryzen 9 5900XT CPUs AMD’s AM4 socket lives on. AMD simply will not allow the last-generation motherboard platform to die. Today, new AMD Ryzen 5000XT series CPUs are now available. These CPUs are new, enhanced, Zen 3 CPU models that boast notable upgrades over their non-XT […]
China's newest homegrown AI chip matches industry standard at 45 TOPS — 6nm Arm-based 12-core Cixin P1 starting mass production

With AI PC hype at a fever pitch, chip vendors Intel, AMD, and Qualcomm are engaged in a fierce dogfight. Meanwhile, relative newcomer Cixin Technology hopes to offer China a domestic alternative for AI performance with the Cixin P1, a brand-new SoC for AI PCs .
The Cixin P1, announced yesterday in a press conference, is an Arm processor built on the 6nm process, with a 12-core CPU at 3.2 GHz, 10
Alphawave develops 3nm UCIe chiplet IP for die-to-die connectivity

Alphawave Semi, an IP and contract chip designer, has developed the industry's first 3nm UCIe chiplet that enables die-to-die connectivity for system-in-packages made on TSMC's chip-on-wafer-on-substrate (CoWoS) packaging technology. The chiplet targets high-demand sectors such as hyperscalers, HPC, and AI, and allows users to build a wide range of system-in-packages (SiPs).
"Achieving successful silicon bring
