Samsung has quietly introduced its new BM1743 solid-state drive , designed for datacenter-grade read-intensive storage applications and offering a combination of capacity of up to 61.44TB and a relatively high performance enabled by a PCIe 4.0/5.0 x4 interfaces. In addition to its first 60TB-class SSD, Samsung also envisions 120TB-class drives using the same type of 3D V-NAND memory
Intel ARC Battlemage reportedly uses TSMC 4nm silicon
Intel’s reportedly moving to TSMC 4nm with their Xe2 “Battlemage” discrete GPUs According to Digitimes, Intel has opted to use TSMC’s 4nm lithography node to power their upcoming Xe2 “Battlemage” discrete GPUs. This is the same lithography node that AMD are using to build their upcoming Ryzen 9000 series GPUs, and a step above the […]
The post Intel ARC Battlemage reportedly uses TSMC 4nm silicon appeared first on OC3D .
Upcoming Apple iPad models hinted in code leak, including a new iPad Mini and M5 Pro sporting model
Serving tech enthusiasts for over 25 years.TechSpot means tech analysis and advice you can trust .
Why it matters: Apple is stepping up its game with its iPad lineup. According to some backend code published on X, the next iPad Pro may sport the yet-to-be-announced M5 chip. Cupertino should also refresh the rest of the line this year or next.
Recently discovered backend code has possibly revealed several upcoming iPad models from Apple, even though it recently introduced the
Intel Z890 could be the only Arrow Lake chipset to support CPU overclocking
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Rumor mill: Intel's upcoming Arrow Lake-S processors will be accompanied by motherboards featuring 800-series chipsets. Earlier leaks provided some details about what the top-of-the-line Z890 chipset will offer, but a new report has now revealed additional information about the other SKUs.
According to tipster Jaykihn, the full 800-series lineup will
Intel 800系主板芯片組規格曝光：CPU原生支持雷電4接口
現在距離Intel下一代處理器發佈大概還有2~3個月的時間，但實際上在台北電腦展上各板廠已經展出了他們的Intel 800系主板，根據最新泄露的消息，Intel 800系主板有5個型號，包括面向消費級的Z890、B860、H81
Samsung quietly launches 61.44TB SSD, talks about a 122.88TB model
傳谷歌Tensor G5已進入流片階段：預計明年量產，採用台積電3nm工藝
Tensor G4很可能是谷歌找三星量產的最後一款SoC，明年將改變策略，在用於Pixel 10系列的Tensor G5上更換代工廠，改用台積電（TSMC）代工。此前泄露的數據庫信息表明，由台積電生產的Tensor G5樣品已經發送出去做驗證。
據Wccftech 報道 ，Tensor
蘋果將採用SoIC封裝技術，預計台積電明年產能會隨之提升
此前有 報道 稱，蘋果探索使用台積電（TSMC）的SoIC技術，已經進行小規模測試，為未來芯片設計做好準備。蘋果是台積電最大的客户，佔據着約四分之一的收入，而且會積極投資先進製程節點，所以雙方近年來尖端芯片製造方面有
AMD's revolutionary exascale APU under the microscope — MI300A processor gets deep dive paper from AMD engineers
The engineers behind the AMD Instinct MI300A APU have published their research on crafting the future of “exascale heterogeneous processing.” The MI300A is the processor at the heart of El Capitan, which is expected to become the world’s fastest supercomputer when it begins operation this year. It is projected to run at two exaFLOPS.
13 AMD scientists cooperated on the recent research paper establishing the ways and means to achieve exaFLOPS performance
Apple iPhone 16 lineup could feature the same A18 chip across all models
Serving tech enthusiasts for over 25 years.
TechSpot means tech analysis and advice you can trust .
TechSpot means tech analysis and advice you can trust .
Highly anticipated: While the four main iPhone 16 variants may sport the same A18 processor, Apple will likely still differentiate the chips in a few ways. One basic approach would be to give them separate marketing names, such as A18 and A18 Pro. Additionally, binning or disabling GPU cores on the standard models to reserve full graphics performance for the iPhone Pro models is the most reasonable assumption
(PR) Demand from AMD and NVIDIA Drives FOPLP Development, Mass Production Expected in 2027-2028
In 2016, TSMC developed and named its InFO FOWLP technology, and applied it to the A10 processor used in the iPhone 7. TrendForce points out that since then, OSAT providers have been striving to develop FOWLP and FOPLP technologies to offer more cost-effective packaging solutions.
Starting in the second quarter, chip companies like AMD have actively engaged with TSMC and OSAT providers to explore the use of FOPLP technology for chip packaging and helping drive industry interest in FOPLP. TrendForce observes that there are three main
Starting in the second quarter, chip companies like AMD have actively engaged with TSMC and OSAT providers to explore the use of FOPLP technology for chip packaging and helping drive industry interest in FOPLP. TrendForce observes that there are three main