Apple Silicon|Intel

Intel's Arrow Lake CPU socket is nearly identical to the old socket — LGA1851 pinout shows one additional USB 2.0 port

Rear panel on motherboard (Image credit: Shutterstock)

New pinout details and I/O information regarding Intel's upcoming Core Ultra 200 series CPUs codenamed Arrow Lake-S and its associated LGA1851 socket have surfaced. Jaykihn0 on X (Twitter) purportedly showed off a complete layout of the LGA1851 socket, along with details surrounding Lunar Lake and Arrow Lake's I/O configuration.

Jay's information reveals that Arrow Lake's I/O connectivity barely

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Apple Silicon|Intel

Qualcomm splashes big money to promote Snapdragon PC chips on Manchester United's jerseys — logo reportedly costs company $75M per year

(Image credit: Qualcomm Technologies, Inc.)

It's not often Tom's Hardware reports on the sports world, but Qualcomm has forced our hand with a major advertising move: Qualcomm has made its Snapdragon logo the new front-of-shirt sponsor for Manchester United Football Club, the most popular football (soccer) team in the United Kingdom.

The Premier League team's claimed 1.1 billion fans will now be presented with the Snapdragon logo on all three variants (home, away, and

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Apple Silicon|Intel

Intel Arrow Lake leak hints at more PCIe lanes and no DDR4 support

Serving tech enthusiasts for over 25 years.TechSpot means tech analysis and advice you can trust .

In context: Chipzilla is hosting several events to highlight the new LGA-1851 socket and the 800-series chipsets to distributors and motherboard manufacturers in the lead-up to the Arrow Lake-S launch. A slide from one of those events has leaked, confirming some of the prevailing rumors about the upcoming platform.

The leaked image originated on the Chinese tech forum ChipHell

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Apple Silicon|Intel

Intel’s next-gen LGA-1851 socket pinout leaks out, Core Ultra 200 platform I/O support detailed

Intel LGA-1851 socket uncovered

A pinout map was shared by Jaykihn.

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Apple Silicon|Intel

RISC-V CPU comes to a mini-ITX motherboard — Jupiter features a SpacemiT K1/M1 chip with 2 TOPS of AI performance

(Image credit: Milk-V)

Milk-V has announced the Jupiter , a mini-ITX motherboard with a RISC-V processor pre-installed. A respected vendor of microcontrollers and RISC-V products, Milk-V brings "RISC-V for everyone" with Jupiter, which will ship soon.

At the Milk-V Jupiter's core is the SpacemiT K1 or M1 processor, a duo of processors powered by eight SpacemiT X60 CPU cores. Specs on the processors and their

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Apple Silicon|Intel

Motherboards and computers based on the Loongson 3A6000 processor are now available

Serving tech enthusiasts for over 25 years.TechSpot means tech analysis and advice you can trust .

Made in China: Chinese company Loongson Technology claims to have developed its new processor technology without copying anything from Western counterparts. The Loongson 3A6000 chip can now be purchased with a motherboard or as part of a complete system, offering a chance to better understand what the hardware can actually accomplish.

AliExpress recently started offering new products based on the Loongson 3A6000

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Apple Silicon|Intel

英特爾Arrow Lake-S具有兩個直連M.2插槽:PCIe 5.0/4.0 x4標準各一個

此前有 報道 稱,英特爾面向桌面平台的Arrow Lake-S裏的K系列與Z890主板預計會在10月發售。由於英特爾會在9月24至25日舉行Innovation 2024峯會,地點在美國加州聖何塞,或許會選擇在這個時候發佈新一代酷睿桌面CPU。

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Apple Silicon

蘋果和谷歌將獲得三星新款OLED面板,引入iPhone 16 Pro系列和Pixel 9系列

蘋果和谷歌有望獲得三星新款“M14”OLED面板,用於今年即將發佈的高端產品上,也就是iPhone 16 Pro系列和Pixel 9系列,雙方的旗艦機型在顯示屏上將保持同步。

據Wccftech 報道 ,三星將會為今年四款iPhone 16系列機型提供OLED面板,不過具


Apple Silicon|Intel

Motherboards and systems with China's Loongson CPUs now shipping to US customers — options start from $373 for a DTX board with processor and cooler

(Image credit: AliExpress)

Two new motherboards for the Chinese-made Loongson 3A6000 CPU are now available on AliExpress. These motherboards are available in various configurations ranging from a barebones motherboard with CPU through a complete prebuilt computer that also includes RAM, a hard drive, and a discrete graphics card.

AliExpress has two motherboard models featuring the Longsoon 3A6000 that are now beginning to ship worldwide. The first, the Loongson 3A6000 7A200

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Apple Silicon|Intel

Samsung reportedly plans to join UALink Alliance — high-speed interconnect could power its next-gen chips

(Image credit: Google)

Samsung has expressed interest in joining the UALink Alliance , which aims to create new interconnect standards for various accelerators, according to DigiTimes . The report suggests that the plan is designed to boost Samsung's foundry business, allowing it to better address its customers' needs. However, Samsung could also develop its own accelerators and connect them using industry standard technology.

At the Samsung Foundry Forum (SFF) 2024, TaeJoong Song, who leads business development at Samsung's foundry division

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