Forward-looking: Apple has reportedly found itself at the front of the line once again for TSMC's latest manufacturing process. Sources familiar with the matter told DigiTimes that Apple is widely believed to be the first client set to utilize TSMC's 2-nanometer manufacturing process.
This is not the first time Apple has been in such an advantageous position as a TSMC client. In
Last August Huawei surprised the industry by launching its HiSilicon Kirin 9000S smartphone processor presumably made by Semiconductor Manufacturing International Corp. (SMIC) using its 2nd generation 7nm-class process technology . Since then, another Kirin 9006C chip showed up, though this one was allegedly made by TSMC years ago . This week a yet another HiSilicon system-on-chip — the Kirin 9000W — transpired.
The eight-core HiSilicon Kirin
此前已有不少傳聞稱天璣9400移動平台和第四代驍龍8移動平台將成為首批採用3nm製程節點的安卓陣容旗艦SoC。近日博主數碼閒聊站 曝料 ，聯發科打算利用台積電的第二代3nm工藝來製造下一代旗艦SoC，而且博文中説到這
AMD has added support for its next-generation accelerated processing units codenamed Strix Point to the ROCm software stack used to program GPUs, as noticed by @Kepler_L2 . The addition confirms that AMD's upcoming processors based on the Zen 5 microarchitecture will feature GPUs based on the RDNA 3.5 architecture.
AMD's Strix Point Halo APU will feature AMD's GFX1151 GPU IP with RDNA 3.5 clusters, whereas regular Strix Point processors will feature
AMD在去年4月發佈了Ryzen Z1系列APU，其中定位較低的Ryzen Z1使用了Zen 4+Zen 4c混合架構的Phoenix2芯片，首次將Zen 4c架構內核帶入消費端市場。不過一直以來，AMD都沒有介紹Zen 4c的具體信息，官網缺乏規格頁面，營銷材料也沒
