Asus has finally officially introduced its flagship graphics card: the ROG Matrix GeForce RTX 4090 . The board comes with the highest out-of-box AD102 GPU clocks, ultimate tweaking ability, a sophisticated voltage regulating module (VRM), an advanced cooling system, and extreme overclockability. Asus has plenty of reasons to suggest this is the world's best graphics card — and it's got a price to match. The ROG Matrix RTX 409
(PR) MSI Announces Updated Z790 MAX and B760 Gaming Motherboards with Optional USB4 Support
MSI is excited to announce today the brand-new MAX Series Motherboards for the Z790 chipset and Micro-ATX motherboards for the B760 chipset, which includes the MEG Series, MPG Series, MAG Series, and PRO Series. MSI's Z790 and B760 motherboards paired with Intel Core Next-gen, 13th Gen, and 12th Gen Processors are here to bring even more performance and fine-tuning on the success of the last generation of
蘋果最快於2026年採用台積電2nm工藝，英偉達或會跟進用於製造AI芯片
近日，蘋果正式發佈了iPhone 15系列智能手機。其中iPhone 15 Pro和iPhone 15 Pro Max兩款機型搭載了新款A17 Pro，這是蘋果首款採用3nm工藝製造的芯片，由台積電（TSMC）負責製造，這也是業界首個3nm的同類芯片。
眾所周知，蘋果是台
Pat Gelsinger Says 3D Stacked Cache Tech Coming to Intel
Intel CEO Pat Gelsinger, in the Q&A session of InnovatiON 2023 Day 1, confirmed that the company is developing 3D-stacked cache technology for its processors. The technology involves expanding the on-die last-level cache (L3 cache) of a processor with an additional SRAM die physically stacked on top, and bonded with the cache's high-bandwidth data fabric. The stacked cache operates at the same speed as the on-die cache, and so the combined cache size
Intel Flashes World’s First UCIe-Connected Chiplet-Based CPU
Intel CEO Pat Gelsinger displayed the world’s first UCIe-connected chiplet-based processor here at Innovation 2023, marking the first public display of working UCIe-enabled silicon. The chip features an Intel UCIe IP chiplet fabbed on its own Intel 3 process node paired with a Synopsys UCIe IP chip fabbed on the leading-edge TSMC N3E node. The two chiplets communicate via Intel’s EMIB interface.
The Universal Chiplet Interconnect Express (UCIe) interface is supported
谷歌將繼續與三星合作：下一代Tensor G4將採用4LPP+工藝
谷歌今年帶來了Tensor G3，是首款支持AV1編碼的智能手機SoC，用在旗艦產品Pixel 8和Pixel 8 Pro上。與高通第三代驍龍8及聯發科天璣9300競爭性能寶座不同，谷歌無意讓Tensor G3參與其中，更多地是結合自己軟件上的需要，打造合
AMD發佈EPYC“Siena”8004系列處理器：最高64個Zen 4c核心，採用SP6插座
AMD 宣佈 ，推出代號“Siena”的EPYC 8004系列服務器處理器。其瞄準的是單路低端服務器，專注於密度、性能/功率的優化，面向邊緣和電信領域，致力於實現更高的能效，適用於總擁有成本（TCO）較低的低功耗服務器。
EPYC 800