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Chinese OEM ERYING designed a lineup of Micro-ATX and Mini-ITX desktop motherboards with 12th Gen Intel Core H-segment mobile processors. These are processors originally meant for the mobile platform, but which have been hardwired on these motherboards. Since the processor packages are bare-die BGAs, ERYING is using thick copper heatspreaders that protect the processor underneath, but most importantly, provide cooler compatibility for all aftermarket CPU coolers capable of handling Socket LGA1700 processors. This is a clever way of giving

Apple Silicon

傳高通第四代驍龍8採用台積電N3E工藝製造：配NUVIA定製內核，性能提升明顯

EXPREVIEW | March 27, 2023, 12:27 a.m. | Original

近期圍繞高通第三代驍龍8有不少傳聞，比如引入新內核及改變大小核的配置等。不過由於其採用的仍是台積電（TSMC）的4nm工藝，加上並未引入融合了NUVIA技術的定製內核，所以大家更為關心的是明年的驍龍8系列SoC。

近日有網

Apple Silicon

三星計劃開發自研移動GPU：新IP基於AMD RDNA系列架構

EXPREVIEW | March 27, 2023, 12:01 a.m. | Original

Deleted

三星在去年推出了Exynos 2200，採用了4nm EUV工藝製造，配備了基於AMD RDNA 2架構的三星Xclipse圖形處理單元，以及基於Arm架構的CPU內核和升級的NPU（神經處理單元），搭載在Galaxy S22系列智能手機上。

雖然Exynos 2200並沒有想象中那

Apple Silicon

AMD官方編程指南確認：即將推出混合架構設計APU

EXPREVIEW | March 26, 2023, 9:06 p.m. | Original

Deleted

前一段時間有報道稱，在MilkyWay@Home數據庫裏出現了AMD尚未公佈的處理器，顯示其配備了6個核心12線程，其中包含了兩個性能核及四個能效核，新芯片擁有類似Big.Little的設計，有專業人士認為，這是AMD代號為“Phoenix 2”的APU。其性

Apple Silicon|Intel

Intel LGA 7529 Socket Photographed Again, Comparisons Show Gargantuan Physical Footprint

TechPowerUp News | March 25, 2023, 1:38 p.m. | Original

A set of detailed photos has been uploaded to a blog on the Chinese Bilibili site , and the subject matter is an engineering sample of a motherboard that features Intel's next generation LGA 7529 socket. Specifications and photos relating to this platform have cropped up in the past, but the latest leak offers many new tidbits of information. The Bilibili blogger placed a Sapphire Rapid Xeon Processor on top of the the new socket, and this provides an interesting point of reference - it demonstrates the expansive physical footprint that

Apple Silicon|Intel

Intel Alder Lake-H CPUs up to Core i7-12700H are now available with desktop motherboards

VideoCardz | March 25, 2023, 8:08 a.m. | Original

ERYING motherboards are a hybrid of desktop and mobile architectures

Chinese motherboard maker puts mobile Alder Lake CPUs on desktop platform.

A company called Erying is now offering up to 14-core Intel Alder Lake CPU with their next-gen desktop motherboard series. This is a successor to a popular Core i7-11800H Tiger Lake platform that was announced one and half years ago. It came in many forms, including laptop, Mini-PC and later desktop motherboard form. Those CPUs were preinstalled (

Apple Silicon

Apple A17 Bionic SoC Performance Targets Could be Lowered

TechPowerUp News | March 21, 2023, 7:28 p.m. | Original

Apple's engineering team is rumored to be adjusting performance targets set for its next generation mobile SoC - the A17 Bionic - due to issues at the TSMC foundry. The cutting edge 3 nm process is proving difficult to handle, according to industry tipsters on Twitter . The leaks point to the A17 Bionic's overall performance goals being lowered by 20%, mainly due to the TSMC N3B node not meeting production targets. The factory is apparently lowering its yield and execution targets due to

Apple Silicon|Intel

Nvidia tweaks flagship H100 chip for export to China as H800 - Reuters

Reuters | March 21, 2023, 12:17 p.m. | Original

Nvidia tweaks flagship H100 chip for export to China as H800 Reuters

Apple Silicon|Intel

(PR) ADLINK IMB-M47H ATX Motherboard based on 12th/13th Gen Intel Core Processors Provides Scalable Edge AI Solutions with Efficiency

TechPowerUp News | March 21, 2023, 11:24 a.m. | Original

ADLINK Technology Inc., a global leader in edge computing, a global supplier of industrial PCs and motherboards, and a Titanium member of the Intel Partner Alliance, announces the launch of the new IMB-M47H industrial ATX motherboard for 12th/13th Gen Intel Core i9/i7/i5/i3, Pentium and Celeron processors. The IMB-M47H ATX motherboard delivers scalable, high-performance computing power and supports three simultaneous independent displays, external USB

Apple Silicon

蘋果A17 Bionic性能提升幅度或低於預期：不超過20%，受台積電3nm工藝影響

EXPREVIEW | March 21, 2023, 6:15 a.m. | Original

近期涉及A17 Bionic的一些消息在網絡上流傳，甚至出現了疑似的泄露測試成績，之所以這麼受關注，一定程度上與蘋果首次引入台積電（TSMC）的3nm工藝有關。由於過去兩三年裏，蘋果A系列SoC性能提升幅度較小，不少人都期待

Chinese OEMs Re-purpose "Alder Lake-H" Mobile Processors on Convenient Desktop Motherboards

傳高通第四代驍龍8採用台積電N3E工藝製造：配NUVIA定製內核，性能提升明顯

三星計劃開發自研移動GPU：新IP基於AMD RDNA系列架構

AMD官方編程指南確認：即將推出混合架構設計APU

Intel LGA 7529 Socket Photographed Again, Comparisons Show Gargantuan Physical Footprint

Intel Alder Lake-H CPUs up to Core i7-12700H are now available with desktop motherboards

ERYING motherboards are a hybrid of desktop and mobile architectures

Apple A17 Bionic SoC Performance Targets Could be Lowered

Nvidia tweaks flagship H100 chip for export to China as H800 - Reuters

(PR) ADLINK IMB-M47H ATX Motherboard based on 12th/13th Gen Intel Core Processors Provides Scalable Edge AI Solutions with Efficiency

蘋果A17 Bionic性能提升幅度或低於預期：不超過20%，受台積電3nm工藝影響

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