As reported by BusinessKorea, Apple, one of the largest companies in the world, will source its 3D NAND from Chinese memory maker Yangtze Memory Technologies Corp (YMTC). Known for supplying 3D NAND to Chinese SSD makers, YTMC's reported contract with Apple will fuel the upcoming iPhone 14 SKU manufacturing. Whether or not this partnership will expand to other products, it is essential to have as many storage sources as possible, as Apple sells millions of devices per year. YTMC is on track to deliver

數個月前有報道稱，蘋果正在尋求增加iPhone存儲芯片供應商，有可能是國內的長江存儲。蘋果正在測試長江存儲生產的NAND閃存芯片樣品，進行驗證已有一段時間，甚至有傳言長江存儲128層堆疊的3D NAND閃存已通過蘋果的驗證。

SiFive, Inc., the founder and leader of RISC-V computing, today announced it has been selected by NASA to provide the core CPU for NASA's next generation High-Performance Spaceflight Computing (HPSC) processor. HPSC is expected to be used in virtually every future space mission, from planetary exploration to lunar and Mars surface missions. HPSC will utilize an 8-core, SiFive Intelligence X280 RISC-V vector core, as well as four additional SiFive RISC-V cores, to deliver

Qualcomm this morning is taking the wraps off a pair of new SoCs for the mid-range and entry-level smartphone markets. Refreshing the company’s longstanding 600 and 400 series of chips, Qualcomm is announcing the Snapdragon 6 Gen 1 and Snapdragon 4 Gen 1. Both SoCs are receiving similar spec bumps, incorporating newer and faster IP blocks from Qualcomm – such as Arm Cortex-A78 derived CPU cores – as well as moving to newer, more contemporary manufacturing processes.

The Snapdragon 6

Intel has announced the availability of its 12th Gen Intel Core SoC processors for IoT Edge. Representing a new lineup of purpose-built edge products optimized for Internet of Things (IoT) applications, this first-of-its-kind socketed system-on-chip (SoC) delivers high performance integrated graphics and media processing for visual compute workloads, a compact footprint to enable smaller innovative form factor designs, and a wide operating thermal design power (TDP) that enables fanless designs and helps customers achieve product sustainability