今年除了 Intel 加入到 Desktop 顯示卡的戰場，型成了 AMD、NVIDIA、Intel 三股勢力外，未來可能還會再增加一個競爭者 Imagination Technologies (IMGTech)。
IMGTech 的總部位於英國，已成立 30 年，專注 GPU 開發，很早期也曾經做過 3D 顯示卡，不過失利後改為專注 Mobile GPU 市場，
谷歌Tensor 3 SoC將採用三星3nm工藝，用於2023年發佈的Pixel 8系列
此前有 報道 稱，三星正在測試幾款新的SoC，其中有一款可能是下一代的Tensor芯片。這款被曝光的SoC型號為S5P9865，與初代Tensor芯片的型號（S5P9845）非常相似，據推測，有可能是用於明年Pixel 8系列的Tensor 3 SoC。
據Business Korea
微軟或合併Surface Pro系列產品線，Surface Pro 9將同時有x86和Arm版本
微軟在2013年首次推出了Surface Pro系列產品線，搭載了英特爾的x86處理器，經過多年的耕耘，已擁有一定的市場認知度。到了2019年，微軟又推出了Surface Pro X系列產品線，採用了基於Arm架構的高通定製SQ1處理器。
據Windows Central
(PR) Intel Taps MIPS eVocore for Intel Pathfinder for RISC-V
MIPS, a leading developer of highly scalable RISC processor IP, announced it is working with Intel to accelerate innovation in open computing. As part of this effort, MIPS' eVocore is being incorporated into the new Intel Pathfinder for RISC-V, a platform designed to deliver new capabilities for pre-silicon development. Intel Pathfinder allows new ways for System-on-a-Chip (SoC) architects and system software developers to define new products and pursue pre-silicon software development on RISC-V.
"MIPS is
TSMC Confirms Plans to Start 3nm Production Shortly
TSMC (Taiwan Semiconductor Manufacturing Co.) is set to start production using its N3 (3nm-class) fabrication process shortly, the company said at an event on Tuesday. Formally, the company does not disclose customers who plan to use its N3 manufacturing technology first, but unofficial sources indicate that Apple will be TSMC's alpha customer for the production node.
TSMC intends to kick off high volume manufacturing of chips on its N3 fabrication technology 'soon,' according
AMD更新CPU架構路線圖，並預告RDNA 3架構GPU
AMD在剛剛的“together we advance_PCs”的直播活動中， 發佈 了新一代基於Zen 4架構的Ryzen 7000系列桌面CPU，採用5nm工藝製造。全新的AM5平台支持PCIe 5.0和DDR5內存，AMD承諾對新平台提供支持至少會到2025年。
圖：來自 TechPowerup
在此次
入門板入支援 PCIe 5.0 – AMD Zen 4 發佈在即，主機板晶片組資訊曝光
AMD Zen4 架構的 Ryzen 7000 系列處理器即將上市，而伴隨而來的當然還有 600 系列主機板，包括 X670E、X670、B650 以及 B650E 等等。
當中最高階的 X670E (Extreme) 為首次採用雙晶片設計，支援的 USB、PCIe、SATA
傳三星正在測試谷歌下一代Tensor芯片，以及Exynos 1380
在今年6月份的 谷歌 I/O 2022 開發者大會 上，谷歌發佈並展示了一系列產品，其中談及了今年即將發佈的新一代旗艦智能手機Pixel 7和Pixel 7 Pro，將搭載第二代自研的SoC，不過並未透露太多的細節。
目前Pixel 6和Pixel 6 Pro上，谷歌
Samsung To Keep Using AMD's RDNA GPUs For Exynos SoCs
Although Samsung's Xclipse 920 integrated graphics processing unit based on AMD's RDNA 2 architecture has not lived up to expectations, the consumer electronics giant will continue to use AMD's RDNA architectures for its future built-in GPUs, the company disclosed on Thursday (opens in new tab) .
"We plan to continue to implement other features in the RDNA series by working closely with AMD going forward," said (opens in new tab) Sungboem Park, a vice
AMD Set to Become TSMC's Second Largest Customer for 5 nm Products
As AMD is ramping up production of its next-generation CPUs and GPUs, it is set to become the second largest client of TSMC's N5 (5nm-class) production node platform in the second half of 2022, according to a DigiTimes report. But will it become the foundry's second largest customer overall? If so, it would be behind Apple, but ahead of MediaTek.
AMD is set to launch a multiple new products made using various