Through its official Twitter account, Samsung published a short, 7-second video that serves as an appetizer for the main course: The marriage of Samsung's Exynos Arm SoC IP with AMD's graphics expertise in RDNA2 is finally coming to fruition. According to Samsung, playtime (for its rivals, it seems?) will be over come January 11th.
The seven-second teaser seems to be set in a sci-fi landscape (the alien kind of gives
The specifications of the upcoming 65W and 35W CPUs from Intel 12th Gen Core “Alder Lake-S” series have just been confirmed by two motherboard vendors, as spotted by leaker @momomo_us .
Intel 12th Gen Core Alder Lake-S Specifications, Source: ASUS & Colorful
With this leak, we have a confirmation on nearly all upcoming Core non-K 65W and low-power T
Intel's new RM1 Stock Cooler has been tested, and it is surprisingly effective
It looks like Intel's planning to launch new Alder Lake series processors at CES 2022, and alongside them will launch new LGA1700 heatsinks from team blue. One of these heatsinks is the RM1, which
A range of ASRock Intel 600-series motherboards has been leaked.
We were given photos of three H670, four B660, and four H610 motherboards from ASRock. This is yet another proof that the rumors about H670 chipset cancelation couldn’t be further from the truth. All three chipsets appear at the same time, indicating their launch is coordinated for the same date.
While ASRock did launch its
To optimize embedded and mobile applications for today's IoT requirements, AAEON, a leading manufacturer of advanced hardware platforms for SDN, NFV, SD-WAN and white box uCPE solutions, today announced the launch of NanoCOM-TGU, a COM Express Type 10 Powered by the 11th Generation Intel Core Processor Family (formerly Tiger Lake UP3). Our NanoCOM-TGU not only offers powerful computing capability, but also the graphical processing power enabled by Intel UHD Graphics to optimize AI and Deep Learning applications in
AMD's new Rembrandt APUs are shaping up to be mobile gaming monsters
Rumour has it that AMD plans to reveal Ryzen 6000 series Mobile CPUs at CES 2021, utilising Rembrandt silicon that features refined Zen 3 CPU cores and an RDNA 2 integrated graphics component.
With their Ryzen 9 6900
蘋果正在按計劃從英特爾x86處理器轉向自研芯片，隨着2022年多款Mac新品的發佈，很可能除了最高端的Mac Pro以外，全部採用M系列自研芯片。此前有媒體 報道 ，蘋果的自研芯片計劃是每18個月更新一次。按照該時間表
According to a leaked spec sheet , support for dual-socket AMD Threadripper systems appears to be coming with the incoming 5000-series chips, meaning two chips can work in tandem in one system (like a dual-socket server), thus bringing up to 128 cores to workstations. As expected, AMD's family of next-generation Ryzen Threadripper Pro 5000WX-series CPUs for high-end workstations will be based on the Zen 3