A few years ago, MediaTek decided to leave the high-end mobile device SoC space as it decided to focus on the mid-range and entry level market, but as of today, that is no longer the case. The company has announced its new flagship Dimensity 9000 SoC and it packs all the latest cutting edge mobile SoC features you'd expect to see.

The Dimensity 9000 is based entirely on the new Arm v9 architecture and the chip itself is built in TSMC'

早在兩個月前就有 報道 稱，聯發科是AMD未來SoC上調制解調器的首選合作伙伴，而且還存在成立合資公司的可能性。由於雙方在業務上重疊的部分相對較少，可能會有互補的作用。AMD也希望通過這種方式，擴大自己的移動市場的影

With its 12th Gen Core "Alder Lake-P" mobile processors still on the horizon, Intel is already building test batches of the 14th Gen "Meteor Lake" mobile processors, at its Fab 42 facility in Chandler, Arizona. "Meteor Lake" is a multi-chip module that leverages Intel's Foveros packaging technology to combine "tiles" (purpose built dies) based on different silicon fabrication processes depending on their function and transistor-density/power requirements. It combines four distinct

With its 12th Gen Core "Alder Lake-P" mobile processors still on the horizon, Intel is already building test batches of the 14th Gen "Meteor Lake" mobile processors, at its Fab 42 facility in Chandler, Arizona. "Meteor Lake" is a multi-chip module that leverages Intel's Foveros packaging technology to combine "tiles" (purpose built dies) based on different silicon fabrication processes depending on their function and transistor-density/power requirements. It combines four distinct

With its 12th Gen Core "Alder Lake-P" mobile processors still on the horizon, Intel is already building test batches of the 14th Gen "Meteor Lake" mobile processors, at its Fab 42 facility in Chandler, Arizona. "Meteor Lake" is a multi-chip module that leverages Intel's Foveros packaging technology to combine "tiles" (purpose built dies) based on different silicon fabrication processes depending on their function and transistor-density/power requirements. It combines four distinct

Today, MediaTek is re-entering the flagship SoC space with a bang. The Dimensity 9000 is the first Armv9 SoC, with X2, A710 and A510 cores, large new GPU, massive new ISP, first LPDDR5X, and all in a new TSMC N4 process node.