A new single-board computer based on the RISC-V architecture has been revealed by StarFive, who previously announced , then cancelled the Beagle V in 2021. The $149 VisionFive V1 as reported by Liliputing looks set to be a rival for the Raspberry Pi .
SAPPHIRE Technology announces the new SAPPHIRE GearBox 500 Thunderbolt 3 eGFX Enclosure now available as a solution with the PULSE AMD Radeon RX 6600 XT 8 GB AMD RDNA 2 Graphics Card. The Gearbox 500 eGFX Enclosure features an updated chassis design that with improved airflow that when connected to the latest graphics cards drastically improves the performance of Thunderbolt 3 / 4 Mac or Windows 10 enabled devices.
Designed for users that need the performance boost to run bandwidth intensive applications such as professional software and the latest 1
蘋果在今年秋季第二場新品發佈會上，帶來全新一代面向專業用户級別的14英寸和16英寸MacBook Pro，搭載了M1 Pro或M1 Max芯片。相比之前的M1，M1 Pro和M1 Max芯片在性能上有相當大的提升幅度，其性能超出了不少人的預期
Alder Lake chips may be some of the best CPUs on the market and are also surprisingly already slightly on sale for the holiday season, but getting a compatible Z690 motherboard and perhaps some DDR5 RAM to go with it is still a pricey prospect. That's why savvy shoppers might want to go for older chips instead, especially if they want to stick with Windows 10. If you don't want to make manual adjustments, Alder Lake works best on Windows
元宇宙題材持續火熱，著名分析師郭明錤表示，Apple 將於 2022 年推出 AR 擴張實境頭戴設備，且不用與 PC 或 iPhone 連結，而且更會搭載與 Mac 設備相同的台積電生產的處理器。而 Apple 未來的目標是於 10 年內以 AR 取代 iPhone。
此前有報道指出，高通（Qualcomm）即將在11月30日至12月2日舉辦的Snapdragon技術峯會上，推出開發代號為SM8450的新一代SoC。其名字不再是一直流傳的驍龍898，而是改變名稱，名為Snapdragon 8 Gen1。除了保留驍龍稱呼和系列數字
Rumor mill: Apple’s much-awaited mixed reality headset is still at least one year away, but more details have surfaced about the mysterious device. The company will reportedly use custom silicon to make a standalone headset instead of a tethered one, and this could pave the way for the creation of a separate apps and services ecosystem in the future.
Apple's augmented reality headset is widely expected
Rumor mill: Apple's latest silicon, the M1 Pro and M1 Max, have barely come off MacBook Pro assembly lines, and rumors are already circulating about what's next for Apple silicon. Rather than going back to the drawing board and designing chips with even higher specs, why not just knit two Max SoCs together?
As you are probably aware, Apple vowed to completely ween itself off of Intel components by the end of next year. So far, it is right on track. The MacBook
In brief: Apple has reportedly tapped Taiwan Semiconductor Manufacturing Co. (TSMC) to build 5G modems for future iPhones. It's unclear exactly when the new hardware will be ready for deployment, but we are hearing it'll be built on TSMC's 4nm process sometime in 2023.
Sources familiar with the matter told Nikkei Asia that Apple aims to use TSMC’s 4nm manufacturing process for its first in-house 5G modem. The people added that Apple is also working
Samsung is planning to build a $17 billion semiconductor manufacturing facility in Texas as part of efforts to tackle a global shortage of chips.