It appears that Apple has kept a closely-guarded secret regarding its new M1 Max silicon. New pics of the underside of the chip reveal that it may actually have an interconnect bus that enables Multi-Chip-Module (MCM) scaling, allowing the company to stack together multiple dies in a chiplet-based design. That could result in chips with as many as 40 CPU cores and 128 GPU cores. Apple has yet to confirm provisions

A set of three patches sent out by AMD last week add new SMCA bank types in preparation for new CPUs and also bank layout changes for future AMD systems. What makes these patches interesting is, " Future AMD systems will have different bank type layouts between logical CPUs. So having a single system-wide cache of the layout won't be







