Apple Silicon

蘋果會將M1X用於今年的新款MacBook Pro,M2用於明年新款MacBook Air

自蘋果發佈M1以後,人們對蘋果下一款自研芯片有了更高的期待,但是隨着不同的渠道傳出的消息,人們也產生了疑惑,因為新芯片的名字可能都不一樣,一般稱為M1X或M2,有時候甚至不確定是否説的到底是哪一款產品


Apple Silicon|Intel

(PR) ASRock Reveals Windows 11 Compatible Motherboards List

« press release »


ASRock Reveals Windows 11 Compatible Motherboards List

TAIPEI, Taiwan, July 5, 2021 –The global-leading motherboard manufacturer, ASRock, reveals both Intel and AMD motherboards support list for Windows 11. To use Windows 11, TPM 2.0 is required. However, TPM 2.0 verification can be passed by firmware TPM (PTT on Intel platform; fTPM on AMD platform) built in BIOS, which means TPM 2.0 hardware module is not necessary for Windows

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Apple Silicon

AMD 4700S Desktop Kit Features PlayStation 5 SoC Without iGPU

Previously, we have assumed that AMD 4700S desktop kit is based on Xbox Series X APU. Today, according to the findings of Bodnara, who managed to access one of these units, and we got some interesting discoveries. The chip powering the system is actually the PlayStation 5 SoC, which features AMD Zen 2 based system architecture, with 8 cores and 16 threads that can boost up to 3.2 GHz. The board that was tested features SK Hynix GDDR6 memory running at 14

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Apple Silicon|Intel

Qualcomm will reveal the first Nuvia-designed laptop chip in 2022

In brief: Qualcomm bought Nuvia to get a leg up in the laptop processor market, and the company is determined to impress with its next core design in 2022. At the same time, the silicon giant is willing to use Arm designs when needed, as well as licensing Nuvia's architecture for companies that want to make custom server chips.

Qualcomm's last big announcement was the Snapdragon 888+ Mobile Platform that comes with higher clocks and improved machine learning performance and will power new flagship

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Apple Silicon

蘋果和英特爾率先採用台積電3nm工藝技術,後者至少有兩個項目

此前有消息指,蘋果是台積電(TSMC)在訂單方面優先考慮的對象,不僅優先獲得了4nm工藝的產能,還獲得了3nm工藝的首批訂單。蘋果之所以受到青睞,其中一個原因是其龐大的資源。蘋果自研芯片的需求,以及銷量巨大的iPhone


Apple Silicon|Intel

Intel and Apple tipped to be the first to adopt TSMC's N3 node-based chips

In brief: Although we are still about a year away from seeing TSMC 3nm process node being mass-produced, reports about which companies will adopt it have already started to emerge. As it seems, Intel and Apple will be the first to leverage the N3 node, with Apple being the first to release a device powered by it, the next-gen iPad.

Apple has been suggested as one of the first companies to take advantage of the N3 node after reports that it was partnering up with TSMC

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Apple Silicon|Intel

Intel Books Two 3 nm Processor Orders at TSMC Manufacturing Facilities

Intel's struggles with semiconductor manufacturing have been known for a very long time. Starting from its 10 nm design IP to the latest 7 nm delays, we have seen the company struggle to deliver its semiconductor nodes on time. On the other hand, Intel's competing companies are using 3rd party foundries to manufacture their designs and not worry about the yields of semiconductor nodes. Most of the time, that 3rd party company is Taiwan Semiconductor Manufacturing Company (TSMC). Today, thanks to some reporting


Apple Silicon|Intel

Qualcomm to Challenge Intel With Nuvia-Designed Notebook Chips

(Image credit: Qualcomm)

Christiano Amon, the new chief executive of Qualcomm, outlined the company's intentions for its own processors based on technologies developed by Nuvia, a CPU startup the company acquired earlier this year. Qualcomm plans to roll out notebook chips featuring Nuvia's architecture next year, but it will not return to the market of datacenters chips even with Nuvia's promising technologies. Instead, Qualcomm will try to license these cores to other companies.

Nuvia was originally co-founded by ex-Apple


Apple Silicon|Intel

(PR) GIGABYTE Motherboards Feature TPM 2.0 Function to Support Windows 11 Upgrade

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced that the BIOS of their series motherboards, including Intel X299, C621, C232, C236, C246, 200, 300, 400, 500 lineups, as well as AMD TRX40, 300, 400, 500 motherboards are TPM 2.0 function ready,


Apple Silicon|Intel

Intel and Apple First to Adopt TSMC's 3nm Technology: Report

(Image credit: TSMC)

Apple and Intel will be the first to adopt Taiwan Semiconductor Manufacturing Co.'s (TSMC) N3 (3nm) fabrication process when the contract maker of chips deploys in late 2022, Nikkei Asia news agency reported on Friday. Intel is projected to use the technology to make CPUs for PCs and servers, whereas Apple is expected to use the node for its system-on-chips aimed at client devices.

Apple and Intel are currently 'testing their chip designs

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