序言
上星期就為大家介紹了 Intel 平台上相對入門的 H570 主機板,其實 AMD 方面除了高階的 X570 晶片組之外,亦同樣有針對較入門用家的 B550 晶片組,但與 Intel 平台不同之處在於 B550 就同樣可以支援處理器超頻,整體上
此前有消息指,採用RDNA 2架構GPU的Exynos 2200,比Exynos 2100採用的Mali-G78快了30%,不過現階段這款產品存在一些問題仍需要解決,比如發熱比預期高。使得GPU在第二次測試的時候性能會降低20%,第三次則會降低3

According to Ice Universe, a known Samsung leaker, an in-house Exynos processor featuring graphics IP from AMD scores higher than most android phones on the market.
If UL’s own benchmark scoreboard was to be considered, then the mysterious Exynos SoC with RDNA2 GPU would score 55% higher than Exynos 2100 in Samsung flagship’s S21 Ultra phone. This unnamed Exynos chip with RDNA GPU


Forward-looking: At MWC 2021 today, Qualcomm announced it's updating its flagship mobile SoC by increasing the CPU clock of the "biggest core" and using the company's 6th generation AI engine. Expected to release in the third quarter of 2021, the Snapdragon 888+ will be featured in high-end phones of Asus, Honor, Motorola, Vivo, and Xiaomi.
The Qualcomm Snapdragon 888 SoC only made it to phones earlier this year,
As part of today’s International Supercomputing 2021 (ISC) announcements, Intel is showcasing that it will be launching a version of its upcoming Sapphire Rapids (SPR) Xeon Scalable processor with high-bandwidth memory (HBM). This version of SPR-HBM will come later in 2022, after the main launch of Sapphire Rapids, and Intel has stated that it will be part of its general availability offering to all, rather than a vendor-specific implementation.
上星期就為大家介紹了 Intel 平台上相對入門的 H570 主機板,其實 AMD 方面除了高階的 X570 晶片組之外,亦同樣有針對較入門用家的 B550 晶片組,但與 Intel 平台不同之處在於 B550 就同樣可以支援處理器超頻,整體上

It’s been a little over a year since we covered Marvell’s OCTEON TX2 infrastructure processors , and since then, the ecosystem has been evolving in an extremely fast manner – both within Marvell and outside. Today, we’re covering the new generation OCTEON 10 family of DPUs, a whole new family of SoCs, built upon TSMC’s 5nm process node and also for the featuring for the first time Arm’s new Neoverse N2 processors.
Today for the first day of Mobile World Congress, Qualcomm is announcing its usual yearly mini-refresh of its flagship Snapdragon SoC in the form of the new Snapdragon 888+. As in the previous few generations, right around the summer period, Qualcomm is taking advantage of the completed spring device cycle and shifting focus onto newer devices in the second half of the year with, and a new SoC that’s slightly boosts performance.
Back in May, pictures surfaced of a curious-looking Micro-ATX motherboard featuring a so-called "AMD 4700S" SoC. At the heart of these boards were an SoC not unlike the one that powers the Xbox Series X, except that the integrated GPU is completely disabled, with no onboard display outputs. The board is very likely a means for AMD to harvest Xbox Series X/S SoCs with broken iGPUs. It now turns out that the board is an official AMD product, named

Asus’ ROG Maximus XIII Extreme and Extreme Glacial are full-featured Z590 motherboards that include robust power delivery, premium audio with a DAC, five M.2 sockets, 10 GbE and integrated Wi-Fi 6E. The Glacial includes a custom waterblock. While pricing is tough to take, the Extreme ($899) and Extreme Glacial ($1499) represent what flagship-class motherboards should be.


Microsoft and Intel announced on Thursday that Intel Core-powered Windows 11 systems will be able to run apps designed for the Google Android platform. The move brings a host of useful apps and immersive games to upcoming PCs. Separately, the two companies said that Windows 11 systems will natively support multi-monitor connectivity using Intel's Thunderbolt 4 technology.
To bring Android apps to Windows 11, Intel developed its Intel Bridge technology, a runtime post-compiler that allows applications originally