The researcher who brought to attention an abnormal SSD wearout indicator on Apple M1-based Macs earlier this year believes that the company has resolved the issue with the release of its macOS 11.4 operating system. Apple has never acknowledged the problem, so the company hasn't provided any official information on the matter. Meanwhile, those who worry about their drives (which can only be replaced by swapping out the whole motherboard) can now update to the new operating system for some
Here's what to expect at Apple's WWDC this week
Revamped MacBooks. Updated iMessage features. An overhaul of the iPad operating system.
Apple's New MacOS Update Reportedly Fixes SSD Wear Issue on M1 Macs
谷歌在油管已使用自研芯片替換英特爾的CPU，但想要完全取代並不容易·
谷歌旗下的YouTube在網絡視頻中的業界地位舉足輕重，同時其業務的數據量也非常龐大。為了滿足其視頻業務的需要，谷歌早已經開始研發自己的芯片，希望這樣的定製產品，能更高效地完成任務。
據TomsHardware 介紹 ，目前用户每分鐘會向YouTube
Internal email uncovers Apple products that never made it to market: new iPods, 15-inch MacBook Air, and Mac tablet
In context: The Epic vs Apple trial has brought to light a ton of internal information from both companies. Most recently, an internal email showing what Apple was developing back in 2007. From software and services to hardware, most of what is in the email ended up releasing. However, some devices mentioned in the document never hit the shelves.
The email written by Steve Jobs on
NZXT N7 Z590 Motherboard Review: Unique Style, and Capable
Our Verdict
NZXT’s N7 Z590 is a full-featured Z590 motherboard that includes two M.2 sockets, Intel-based Wi-Fi 6E, capable power delivery, premium audio, and more. It’s a well-rounded mid-ranger for Intel’s Z590 platform, though for a similar price, there are other options with more and better parts.
For
- + Wi-Fi 6E/2.5 GbE Networking
- + Improved and
Magic Leap宣佈將與AMD合作開發半定製SoC，或會用於下一代企業級頭顯設備
Magic Leap 宣佈 將會與AMD合作開發AR技術解決方案，該解決方案將包括一個半定製SoC，為企業用户帶來市場領先的視覺計算與感知能力，新的企業級增強現實設備可以更好地與現實世界環境相融合。
隨着全球市場的不斷變化，刺激了對
(PR) Magic Leap Announces Partnership with AMD to Advance Computer Vision and Perception into the Enterprise Market
As global market changes spur demand for augmented reality (AR) technology, there is an increasing need for innovations that combine the best technologies in CPU, GPU and machine learning into a single SOC (system on chip) to allow for the creation of the most demanding AR experiences while maintaining power efficiency.
Magic Leap today announced it is partnering with AMD on an AR technology solution that includes a semi-custom SOC to enable enterprise users to re-imagine and transform how virtual content and information is visualized and merged with real
TSMC's Arizona chip factory is on track for volume production in 2024
In brief: Construction of a $12 billion chip plant in Arizona is “well under way,” Taiwan Semiconductor Manufacturing Company (TSMC) CEO C.C. Wei confirmed during a recent presentation at the company’s annual technology symposium. Should everything go according to plan, the fab will be ready to enter volume production in 2024.
TSMC roughly a year ago said it planned to build a 5nm plant in Arizona with a 20,000 semiconductor wafer per month capacity that
Micron Ships First 1-Alpha DRAM: Extreme Density Without EUV
Micron said on Tuesday that it had started volume production of DRAM chips using its latest 1α (1-alpha) process technology. Initially the company will use the new node for LPDDR4X and 8Gb DDR4 memory ICs, but the company will eventually use the new fabrication tech to produce all of its DRAMs.
Unlike its rivals, Micron does not plan to use extreme ultraviolet (EUV) lithography for at least a few years. However, as the company still needs to
AMD "Zen 3+" Microarchitecture is "Zen 3" with 3D Vertical Cache Technology, 15% Gaming Perf Gain
AMD CEO Dr Lisa Su, in her Computex 2021 Keynote address detailed what could very well be the "Zen 3+" microarchitecture that's been in the news lately. AMD has collaborated with TSMC on developing a new die-on-die 3D stacking technology using TSVs (through-silicon vias) and structural silicon substrate, to place a 64 MB SRAM on top of the "Zen 3" CCD, which it calls 3D Vertical Cache. This cache die sits directly over the
