Apple Silicon

Arm發佈移動端新架構,包括Cortex-X2/A710/A510覆蓋超大核心和大小核心

隨着Arm發佈了Armv9架構,相關的產品也接二連三地推出了。在上個月,Arm發佈了Neoverse V1和Neoverse N2兩個全新平台,這是面向HPC和數據中心的解決方案今天Arm除了推出了新一代的Mali系列GPU,還發布了針對移動端的新架構,包括了 Cortex-


Apple Silicon|Intel

ASUS ROG STRIX Z590-I Gaming WiFi Review

The ASUS ROG STRIX Z590-I Gaming WiFi is a premium ITX platform featuring a powerful VRM with top of the line power stages, Thunderbolt 4, and a unique design that allows both M.2 slots to be located on the front of the board. Let's see what the ROG STRIX Z590-I Gaming WiFi has to offer!


Apple Silicon|Intel

Arm Announces The Cortex-X2 Armv9 Flagship CPU, Cortex-A710, Cortex-A510

Arm today announced the Cortex-X2 as their new flagship Armv9 processor design.

The Cortex-X2 was announced by Arm this morning along with the Cortex-A510 as a new Armv9 "little" core design and the Cortex-A710 was also announced as the Cortex-A78 successor.

Arm's flagship Cortex-X2 is said to deliver +30% better performance against the latest Android flagship smartphones and +40% performance against 20

Apple Silicon|Intel

Arm Introduces Armv9 Cortex-X2, A710, and A510 CPUs, New Mali GPUs

(Image credit: Shutterstock)

Arm whipped the covers off its next-gen series of CPU and GPU cores based on the Armv9 architecture today, along with other system IP, all of which it packages under its Total Compute Solutions collection of technologies.

These new Arm chips span from the flagship Cortex-X2 cores that will power next-gen laptops and mobile devices, with what Arm says is up to 40% more single-threaded performance than modern laptop silicon, down to high-efficiency "Little

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Apple Silicon

(PR) GIGABYTE Unleashes the AORUS Gen 4 7000s Prem. SSD

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today the latest AORUS Gen4 7000s Prem. SSD with up to 7 GB/s read speed while optimizing passive thermal dissipation, which promises no throttling under long-lasting operation. Through the SSD Tool Box application, users can have an instant control on overall operation of SSD.

AORUS Gen4 7000s Prem. SSD adopts the PCIe 4.0 NVMe M.2 interface

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Apple Silicon|Intel

AMD Milan-X rumored to feature stacked dies, X3D packing technology

Please note that this post is tagged as a rumor .

AMD’s product to feature X3D die stacking is Milan-X?

A new rumor suggests AMD is now actively developing Milan chip with stacked dies.

AMD has revealed back in March 2020 that is now working on its X3D packing technology that would feature hybrid 2.5D and 3D design. Today Patrick Schur has revealed a codenamed that might be associated with this technology. The first AMD product to featured stacked dies could

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Apple Silicon

(PR) Qualcomm Announces Snapdragon 7c Gen 2 Compute Platform

Qualcomm Technologies, Inc. today debuted the Qualcomm Snapdragon 7c Gen 2 compute platform, the second generation of the Company's breakthrough entry-level platform for always on, always connected Windows PCs and Chromebooks with efficient performance and support for multi-day battery life. During the Qualcomm Snapdragon Compute: Scaling the Mobile Compute Ecosystem Virtual Announcement, the Company shared that devices powered by Snapdragon 7c Gen 2 will upgrade entry-level device experiences with enhanced camera and audio capabilities, integrated LTE connectivity, AI acceleration, enterprise

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Apple Silicon|Intel

Qualcomm's Snapdragon 7c Gen 2 will power entry-level Windows laptops and Chromebooks

The big picture: Qualcomm's new Snapdragon 7c Gen 2 chipset may not be in the same performance league as the Apple M1, but the devices it's meant for will be significantly less expensive than Apple's offerings. Developers will be able to get dev kits, so hopefully more apps will get ported to Windows 10 on ARM in the near future.

Today Qualcomm announced a new Arm-based compute platform called the Snapdragon 7c Gen 2 set to power low-end laptops in the

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Apple Silicon|Intel

(PR) Cadence Announces New Low-Power IP for PCI Express 5.0 Specification on TSMC N5 Process

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced immediate availability of Cadence IP supporting the PCI Express (PCIe ) 5.0 specification on TSMC N5 process technology. The next follow-on version on TSMC N3 process technology is expected to be taped out in early 2022. Collaboration with major customers is ongoing for N5 SoC designs targeting hyperscale computing and networking applications. The Cadence IP for PCIe 5.0 technology consists of a PHY, companion controller and Verification IP (VIP


Apple Silicon|Intel

Qualcomm 7c Gen 2 Targets Low-End Windows, Chromebooks

(Image credit: Qualcomm)

Qualcomm has a new Arm processor ready for Windows and Chrome. Today, it announced the Snapdragon 7c Gen 2, aimed at laptops starting at $349, which means you probably won’t see it powering the best Ultrabrooks and premium laptops .

The company claims that this will bring premium features to budget machines, including long battery life (Qualcomm will tell you it's "all-day" depending on usage), quick wake from sleep, and a chassis that

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