Arm whipped the covers off its next-gen series of CPU and GPU cores based on the Armv9 architecture today, along with other system IP, all of which it packages under its Total Compute Solutions collection of technologies.
These new Arm chips span from the flagship Cortex-X2 cores that will power next-gen laptops and mobile devices, with what Arm says is up to 40% more single-threaded performance than modern laptop silicon, down to high-efficiency "Little
Please note that this post is tagged as a rumor .
AMD’s product to feature X3D die stacking is Milan-X?
A new rumor suggests AMD is now actively developing Milan chip with stacked dies.

AMD has revealed back in March 2020 that is now working on its X3D packing technology that would feature hybrid 2.5D and 3D design. Today Patrick Schur has revealed a codenamed that might be associated with this technology. The first AMD product to featured stacked dies could






