Samsung is readying a powerful Arm-based SoC rivaling Apple's groundbreaking M1 silicon, under its Exynos brand. This chip is being designed for thin-and-light notebooks, as well as premium tablets, essentially letting Samsung target Apple's MacBook (M1) and iPad Pro form-factors. Unlike Apple, Samsung won't be burdened with having to rally its ISV partners to develop specifically for its hardware; the company is preparing to launch notebooks in the second half of 2021
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today unveiled the industry's first memory module supporting the new Compute Express Link (CXL) interconnect standard. Integrated with Samsung's Double Data Rate 5 (DDR5) technology, this CXL-based module will enable server systems to significantly scale memory capacity and bandwidth, accelerating artificial intelligence (AI) and high-performance computing (HPC) workloads in data centers.
The rise of AI and big data has been fueling the trend
Rumor mill: With the introduction of Apple's M1 SoC, Intel-based Macs will soon be a thing of the past. Rumors have it that Qualcomm is next on the chopping block where Apple suppliers are concerned. Apple has been working on a new custom-designed 5G modem chip that should be ready in a couple of years.
According to noted Apple analyst Ming-Chi Kuo, Apple will soon install its own 5G modems in iPhones. Currently, the company uses 5G baseband chips from
根據之前流傳的消息，桌面平台代號Warhol的Zen 3+架構Ryzen 6000系列CPU已取消，不過同樣採用6nm工藝製造的APU似乎仍然在AMD的計劃裏，並沒有受到影響。
IBM宣佈製造出全球首款2nm工藝節點的芯片，並在紐約州奧爾巴尼的工廠展示了2nm工藝生產的完整300mm晶圓，不過這並不意味着2nm工藝已實現批量生產。無論如何，這也是半導體設計和製造上的一個突破，在性能和能效
The ASRock Radeon RX 6900 XT OC Formula is built using AMD's new Navi 21 XTXH chip, which runs much higher clocks than what the regular RX 6900 XT can achieve. In our testing, this is the first AMD card in a long time to beat NVIDIA's current-generation flagship, the RTX 3090.
Next-gen processor tech gives more performance with less energy use, IBM claims.
IBASE Technology Inc. (TPEx: 8050), IBASE, a leading provider of industrial motherboards and embedded systems, launches its latest 3.5" SBC IB953 powered by 11th Gen Intel Core processors (codenamed Tiger Lake). Measuring 146 x 102 mm in a compact footprint, the single board computer offers impressive I/O and computing performance, making it an ideal platform for a broad range of demanding applications in factory automation, machine vision, healthcare,
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the immediate availability of its next-generation 2.5D packaging technology Interposer-Cube4 (I-Cube4), leading the evolution of chip packaging technology once again. Samsung's I-CubeTM is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.) and several High Bandwidth Memory (HBM) dies on top of a silicon interposer, making multiple dies operate
