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Fujitsu has contributed support for their high-performance A64FX ARMv8-based CPU cores to the LLVM Clang compiler...

Apple Silicon|Intel

台積電發佈最新CoWoS封裝工藝：最大芯片面積可達原版的兩倍

EXPREVIEW | March 8, 2020, 4:12 p.m. | Original

上週台積電和博通聯手公佈了最新強化版的CoWoS封裝工藝，強化版CoWoS能夠支持最大面積為1700mm ² 的中介層，這也就意味着它能夠封裝出更大面積的芯片來，在多芯片上互聯漸成趨勢的現在，更大面積意味着更高的性能上限。

Apple Silicon|Intel

Intel Demonstrates Industry’s First Co-Packaged Switch With 1.6Tbps Silicon Photonics

Tom's Hardware | March 6, 2020, 2:09 a.m. | Original

Intel today announced a new breakthrough for co-packaged silicon photonics optics Ethernet switches. The company has integrated next-generation 1.6Tbps silicon photonics engines with the 12.8Tbps programmable Tofino 2 Ethernet switch Intel acquired from Barefoot Networks last year.

With the emergence of hyperscale cloud data centers, demand for data bandwidth has become practically limitless. To provide cost-effective interconnect solutions, Intel has been on a path to increase the bandwidth of its silicon photonics, which has been available in a 100

Apple Silicon|Intel

AMD "Zen 4" Microarchitecture On Track for 2021-22 Debut with "Genoa"

TechPowerUp News | March 6, 2020, 12:42 a.m. | Original

AMD's 4th generation EPYC line of enterprise processors, now into design stage, impressed the United States Department of Energy enough that it wants to deploy it in "El Capitan," a 2 ExaFLOP supercomputer that will be the world's most powerful, when it goes online around 2022. Codenamed "Genoa," 4th gen EPYC implements AMD's "Zen 4" microarchitecture. While AMD didn't get into too many details about it in its 2020 Financial Analyst None

Apple Silicon

Project Sandcastle revives the dream of running Android on iPhone

TechSpot News | March 5, 2020, 2:37 p.m. | Original

Through the looking glass: The creators behind the first Android on iPhone project over a decade ago are back again with Project Sandcastle. Using lessons learned from virtualization using iOS, an initial build was created that runs in the iPhone 7. Unfortunately, the company behind the project is facing intense litigation from Apple over its virtualization technology.

Have you ever wanted to run Android on an iPhone? Back in 2008, enterprising hackers were able to port the Linux kernel to Apple's original iPhone. The developers behind

Apple Silicon|Intel

AMD最新CPU線路圖：Zen 3今年發，將來會有X3D堆疊和第三代IF總線

EXPREVIEW | March 5, 2020, 1:30 p.m. | Original

AMD在財務分析師日活動上談及了今年即將發佈的Zen 3架構處理器，還有相對遙遠一點的Zen 4架構，現在AMD的Zen架構還在按照原本定下的線路圖一步一步向前邁進。

AMD在會議上給出了截止至2022年的CPU線路圖，Zen 3架構依然會

Apple Silicon|Intel

AMD showcases its CPU/GPU Roadmap to RDNA 3 and Zen 4

Overclock3D.Net | March 5, 2020, 4:13 a.m. | Original

AMD has plans for 5nm, next-gen nodes and more.

Apple Silicon|Intel

Nokia Partners With Intel on 5G Infrastructure Silicon

Tom's Hardware | March 5, 2020, 4:08 a.m. | Original

Nokia today announced its collaboration with Intel on 5G infrastructure silicon, including working together on Intel's recently announced Atom P5900 processor (formerly Snow Ridge). Nokia will also adopt Cascade Lake in its cloud data center solution for a common architecture "from cloud to edge."

Intel announced its portfolio of silicon for 5G New Radio network infrastructure early last week (it originally planned to announce this at Mobile World Congress). It introduced the Atom P59

Apple Silicon|Intel

Unisoc Announces World's First 6nm EUV Chip, the Tiger T7520 5G SoC

Tom's Hardware | March 5, 2020, 12:49 a.m. | Original

(Image credit: Unisoc)

Unisoc announced the industry’s first chip on TSMC’s 6nm EUV process, the eight-core Tiger T7520 5G processor, GizmoChina reported .

TSMC’s 6nm process is a design-compatible extension of its 7nm process with minor PPA (power, performance, area) improvements, most notably an 18% reduction in area, and leverages EUV. It will go into production this year.

Unisoc’s Tiger T7520

Apple Silicon

(PR) UNISOC Launches Next-Gen 5G SoC T7520 on 6 nm EUV Manufacturing Node

TechPowerUp News | March 4, 2020, 7:22 p.m. | Original

UNISOC, a leading global supplier of mobile communication and IoT chipsets, today officially launched its new-generation 5G SoC mobile platform - T7520. Using cutting-edge process technology, T7520 enables an optimized 5G experience with substantially enhanced AI computing and multimedia imaging processing capabilities while lowering power consumption.

T7520 is UNISOC's second-generation 5G smartphone platform. Built on a 6 nm EUV process technology and empowered by some of the latest design techniques, None

Fujitsu A64FX Support Added To The LLVM Clang 11 Compiler

台積電發佈最新CoWoS封裝工藝：最大芯片面積可達原版的兩倍

Intel Demonstrates Industry’s First Co-Packaged Switch With 1.6Tbps Silicon Photonics

AMD "Zen 4" Microarchitecture On Track for 2021-22 Debut with "Genoa"

Project Sandcastle revives the dream of running Android on iPhone

AMD最新CPU線路圖：Zen 3今年發，將來會有X3D堆疊和第三代IF總線

AMD showcases its CPU/GPU Roadmap to RDNA 3 and Zen 4

Nokia Partners With Intel on 5G Infrastructure Silicon

Unisoc Announces World's First 6nm EUV Chip, the Tiger T7520 5G SoC

(PR) UNISOC Launches Next-Gen 5G SoC T7520 on 6 nm EUV Manufacturing Node

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