Apple Silicon

時隔多年之後,iPhone終於又有機會用上Android了

還記得去年九月底iOS設備曝出的 checkm8硬件漏洞 嗎?因為很久沒有在iOS設備上面發現一個底層硬件漏洞了,它被各路開發者玩出花來了,比如基於這個漏洞開發的checkra1n工具已經成功為iPhone 5S到iPhone X之間的iOS設備帶去了越獄,因為

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Apple Silicon

AMD CPUs and GPUs will power the future world's fastest supercomputer, 10x faster than current leader

Something to look forward to: The 'El Capitan' supercomputer at Lawrence Livermore National Laboratory (LLNL) will be built with both AMD processors and GPUs. It is expected to pack more than 2 exaFLOPs of performance and will come online in early 2023. El Capitan will be a huge leap forward in supercomputing performance with more power than the current top 200 fastest systems combined. That is also 10 times faster than the current fastest system.

The new system will be maintained by the US Department

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Apple Silicon|Intel

AMD Scores Another EPYC Win in Exascale Computing With DOE's "El Capitan" Two-Exaflop Supercomputer

AMD has been on a roll in both consumer, professional, and exascale computing environments, and it has just snagged itself another hugely important contract. The US Department of Energy (DOE) has just announced the winners for their next-gen, exascale supercomputer that aims to be the world's fastest. Dubbed "El Capitan", the new supercomputer will be powered by AMD's next-gen EPYC Genoa processors (Zen 4 architecture) and Radeon GPUs. This is the first such exascale contract where AMD isNone
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Apple Silicon|Intel

(PR) AMD EPYC Zen4 “Genoa” and next-generation Radeon Instinct GPUs to power El Captain Supercomputer

Next-Generation AMD EPYC™ CPUs and Radeon™ Instinct GPUs Enable El Capitan Supercomputer at Lawrence Livermore National Laboratory to Break 2 Exaflops Barrier - Collaboration with HPE targets leadership HPC and AI processing performance starting in early 2023 — - El Capitan is set to be the second all AMD CPU and GPU exascale system in the U.S., and is expected to be more powerful than today’s 200 fastest supercomputers combined — AMD (NASDAQ: AMD) today joined Lawrence Livermore National Laboratory (LLNLNone

Apple Silicon|Intel

Intel gets honest about 10nm; it will be less profitable than 22nm

10nm isn't going to be Intel's best node...

Apple Silicon

首款 USB4 主控現身 僅半速 20Gbps 支援 Firmware 升級

美國晶片廠商Cypress 宣佈推出全新單晶片 USB 3.2 主控制器,亦有一定程度上支援未來的 USB4。 […]

Apple Silicon

Cypress發佈支持USB 3.2的控制芯片:可以通過升級固件的形式支持USB 4

Cypress於昨天發佈了兩款新的USB-C控制芯片——EZ-PD CCG6DF和CCG6SF,前者支持雙USB-C接口而後者為單接口控制芯片。兩款芯片上最大的亮點就是可以支持最新的USB 4和Thunderbolt標準。

CCG6DF_CCG6SF_Banner

兩款芯片都是基於ARM Cortex-M0架構打造,屬於3


Apple Silicon|Intel

Intel重啟哥斯達黎加封裝廠,以緩解產能不足的問題

去年Intel遭遇了嚴重的產能不足問題,後來隨着10nm處理器的產力爬坡開始逐漸緩解,但是10nm的處理器現在只面向低功耗的移動平台供應,而大量的桌面、服務器以及高性能移動平台依然在使用14nm的處理器,我記得前段


Apple Silicon|Intel

TSMC's New CoWoS Tech Doubles Memory Bandwidth

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(Image credit: Shutterstock)

TSMC announced a partnership with Broadcom to introduce an enhanced Chip-on-Wafer-on-Substrate (CoWoS) platform, a 2.5D integrated circuit (2.5D IC) through-silicon via (TSV) interposer-based packaging technology, that supports the industry’s first and largest full 2x reticle size interposer.

The next generation CoWoS interposer has an area of approximately 1,700mm2 and can be used to boost computing power for high


Apple Silicon|Intel

Next Generation Arm Server: Ampere’s Altra 80-core N1 SoC for Hyperscalers against Rome and Xeon

Several years ago, at a local event detailing a new Arm microarchitecture core, I recall a conversation I had with a number of executives at the time: the goal was to get Arm into 25% of servers by 2020. A lofty goal, which hasn’t quite been reached, however after the initial run of Arm-based server designs the market is starting to hit its stride with Arm’s N1 core for data-centers getting its first outings. Out of those announcing an

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