At next week’s annual VLSI Symposium, Intel will be presenting a trio of highly-anticipated papers about their progress with their upcoming PowerVia chip fabrication technology – the company’s in-development implementation of backside power delivery networks. Along with Intel’s RibbonFET technology for gate-all-around transistors, PowerVia and RibbonFET are slated to serve as Intel’s big one-two punch to the rest of the silicon lithography industry, introducing two major chip technologies together that Intel believes will vault them back into the

At Computex 2023, TeamGroup unveiled two additions to its extensive family of memory products. Available with ARGB heatsinks or subtle black non-RGB heatsinks, the TeamGroup T-Force Xtreem DDR5 memory promises high performance for memory overclockers and gamers.

Looking to rival the high-speed DDR5 kits from companies such as G.Skill, the T-Force Xtreem DDR5 memory is available up to DDR5-8266, with overclocked XMP 3.0 profiles designed to be used with Intel

Dynamic random access memory is an indispensable part of all computers, and requirements for DRAM — such as performance, power, density, and physical implementation — tend to change now and then. In the coming years, we will see new types of memory modules for laptops and servers as traditional SO-DIMMs and RDIMMs/LRDIMMs seem to run out of steam in terms of performance, efficiency, and density.

ADATA demonstrated potential candidates to replace SO-DIMMs and RDIMMs/LRDIMMs from client and server machines, respectively, in

Dynamic random access memory is an indispensable part of all computers, and requirements for DRAM — such as performance, power, density, and physical implementation — tend to change now and then. In the coming years, we will see new types of memory modules for laptops and servers as traditional SO-DIMMs and RDIMMs/LRDIMMs seem to run out of steam in terms of performance, efficiency, and density.

ADATA demonstrated potential candidates to replace SO-DIMMs and RDIMMs/LRDIMMs from client and server machines, respectively, in

At Computex 2023 in Taipei, Taiwan, ASRock unveiled two motherboards based on its popular and long-running Taichi series, but with a slight twist. Designed to offer an alternative to their flagship Taichi series, the Z790 Taichi Lite and B650E Taichi Lite, as the model naming suggests, are lighter versions of their premium models. Still maintaining the Taichi aesthetic and retaining several premium features, the Taichi Lite series offers a lower-cost alternative to ASRock's flagship line

Meta on Thursday announced the Quest 3, its next generation all-in-one untethered VR/MR headset. The updated headset is based around a newer Qualcomm SoC for VR/MR applications, offering increased performance, a higher resolution display, improved controllers, an all-new 6-degree-of-freedom (6DoF) positional tracking system, and backwards compatibility with existing software developed for existing the Quest headset.

Meta's Quest 3 comes with the company's 'highest resolution display yet' coupled

Without much fanfare, Biostar has introduced its first graphics card based on Intel Arc graphics processors. The add-in-board is aimed at entry-level gaming PCs, and is admittedly not very remarkable itself. But the fact that Intel has a new AIB partner, and that Biostar now has graphics cards powered by GPUs from all three major vendors, are important developments for the wider industry.

The Biostar Intel Arc A380 graphics card demonstrated at Computex 2023 is based on the ACM-G

With the Wi-Fi 7 (IEEE 802.11be) train set to roll into the mainstream later this year, ASRock looks to be getting ahead of the curve with two new Z790 motherboards featuring the latest Wi-Fi 7 CNVI's. The more premium of the pairing, the ASRock Phantom Gaming Z790 Nova WiFi7 combines Wi-Fi 7 connectivity with several notable features, including a large power delivery, one PCIe 5.0 x4 M.2

For Computex 2023, Streacom is demonstrating its SG10 passively-cooled PC chassis that can accommodate high-end PCs without requiring active cooling fans. The SG10 case is designed for fully-fledged gaming PCs, and is rated to passively dissipate up to 600W of heat – effectively using parts of the case as a giant heatsink, in place of traditional fans and through-case airflow dynamics.

Besides being a fairly beefy bit of metal in its own right, internally Streacom'

TeamGroup is demonstrating at Computex 2023 what it claims to be the world's first all-in-one liquid cooling system for hot-running M.2 SSDs. The SSD-sized Siren cooler is meant to ensure that high-end drives offer consistently high performance for prolonged periods, given the propensity for first-generation PCIe 5.0 SSDs to heat up and throttle under sustained heavy write workloads.

In a sign of the times in the high-end SSD space, TeamGroup has developed a