TSMC Details N4X Process for HPC: Extreme Performance at Minimum Leakage
At its 2023 Technology Symposium TSMC revealed some additional details about its upcoming N4X technology that is designed specifically for high-performance computing (HPC) applications. This node promises to enable ultra-high performance and improve efficiency while maintaining IP compatibility with N4P (4 nm-class) process technology.
"N4X truly sets a new benchmark for how we can push extreme performance while minimizing the leakage power penalty," said Yujun Li, TSMC's director of business development who is
NVIDIA Reports Q1 FY2024 Earnings: Bigger Things to Come as NV Approaches $1T Market Cap
Closing out the most recent earnings season for the PC industry is, as always, NVIDIA. The company’s unusual, nearly year-ahead fiscal calendar means that they get the benefit of being casually late in reporting their results. And in this case, they’ve ended up being the proverbial case of saving the best for last.
For the first quarter of their 2024 fiscal year, NVIDIA booked $7.2 billion in revenue, which is a 13% drop over the year-
TSMC: We Have Working CFET Transistors in the Lab, But They Are Generations Away
Offering an update on its work with complementary field-effect transistors (CFETs) as part of the company's European Technology Symposium 2023, TSMC has revealed that it has working CFETs within its labs. But even with the progress TSMC has made so far, the technology is still in its early days, generations away from mass production. In the meantime, ahead of CFETs will come gate-all-around (GAA) transistors, which TSMC will be introducing with its TSMC's upcoming N2
Corsair Launches 2000D Airflow SFF Cases For Triple-Slot GPUs
Corsair has expanded the brand's mini-ITX case lineup with the new 2000D Airflow series. The 2000D Airflow and 2000D RGB Airflow small-form-factor (SFF) cases cater specifically to compact but high-performance systems. With a volume of 24.4 liters, the Corsair 2000D series cases have enough landscape to house the most demanding hardware, including a 360 mm AIO CPU liquid cooler and full-size
AMD Launches Zen 2-based Ryzen and Athlon 7020C Series For Chromebooks
Last year, AMD unveiled their entry-level 'Mendicino' mobile parts to the market, which combine their 2019 Zen 2 cores and their RDNA 2.0 integrated graphics to create an affordable selection of configurations for mainstream mobile devices. Although much of the discussion over the last few months has been about their Ryzen 7040 mobile parts, AMD has launched four new SKUs explicitly designed for the Chromebook space, the Ryzen and Athlon 7020C series.
Some of the most notable features
Micron Expects Impact as China Bans Its Products from 'Critical' Industries
In the latest move in the tit-for-tat technology trade war between the United States and China, on Sunday the Cyberspace Administration of China announced that it was effectively banning Micron's products from being purchased in the country going forward. Citing that Micron's products have failed to pass its cybersecurity review requirements, the administration has ordered that operators of key infrastructure should stop buying products containing chips from the U.S.-based company.
"The review found that Meiguang's products have serious hidden dangers
Intel HPC Updates For ISC 2023: Aurora Nearly Done, More Falcon Shores, and the Future of XPUs
With the annual ISC High Performance supercomputing conference kicking off this week, Intel is one of several vendors making announcements timed with the show. As the crown jewels of the company’s HPC product portfolio have launched in the last several months, the company doesn’t have any major new silicon announcements to make alongside this year’s show – and unfortunately Aurora isn’t yet up and running to take a shot at the Top 500 list. So, following a tumultuous year thus far that has seen significant
Kioxia BG6 Series M.2 2230 PCIe 4.0 SSD Lineup Adds BiCS6 to the Mix
Kioxia's BG series of M.2 2230 client NVMe SSDs has proved popular among OEMs and commercial system builders due to their low cost and small physical footprint. Today, the company is introducing a new generation of products in this postage stamp-sized lineup. The BG6 series builds up on the Gen 4 support added in the BG5 by updating the NAND generation from BiCS5 (112L) to BiCS6 (162L) for select capacities. The increase in
Micron to Bring EUV to Japan: 1γ Process DRAM to Be Made in Hiroshima in 2025
Micron this week officially said that it would equip its fab in Hiroshima, Japan, to produce DRAM chips on its 1γ (1-gamma) process technology, its first node to use extreme ultraviolet lithography, in 2025. The company will be the first chipmaker to use EUV for volume production in Japan and its fabs in Hiroshima and Taiwan will be its first sites to use the upcoming 1γ technology.
As the only major DRAM maker that has not adopted extreme ultraviolet lithography, Micron planned to start
Samsung Kicks Off DDR5 DRAM Production on 12nm Process Tech, DDR5-7200 in the Works
Samsung on Thursday said it had started high volume production DRAM chips on its latest 12nm fabrication process. The new manufacturing node has allowed Samsung to reduce the power consumption of its DRAM devices, as well as decrease their costs significantly compared to its previous-generation node.
According to Samsung's announcement, the company's 12nm fabrication process is being used to produce 16Gbit DDR5 memory chips. And while the company is already producing DDR5 chips with that capacity (e.g.