TSMC Shares More Info on 2nm: New MIM Capacitor and Backside PDN Detailed
TSMC has revealed some additional details about its upcoming N2 and N2P process technology at its European Technology Symposium 2023. Both production nodes are being developed with high-performance computing (HPC) in mind, so, they feature a number of enhancements designed specifically to improve performance. Meanwhile, given the performance-efficiency focus that most chips aim to improve upon, low-power applications will also take advantage of TSMC's N2 nodes as they will naturally improve performance-per-watt compared
MSI Intros USB4 PCIe Expansion Card with 100W Power Delivery
For Computex 2023, MSI is introducing an interesting USB4 PCIe expansion card. The card not only offers two full-bandwidth USB4 40Gbps Type-C ports, but the card can also deliver up to 100W of power to a device connected to it, allowing it to be used to power high-drain devices like laptops.
The MSI USB4 PD100W Expansion Card (MS-4489) has two DisplayPort inputs as well as two USB
Asus Details ROG Matrix GeForce RTX 4090: Liquid Cooling Meets Liquid Metal
Asus has introduced a new flagship RTX 4090 graphics card that uses an all-in-one liquid cooling system combined with liquid metal thermal interface. Dubbed the ROG Matrix GeForce RTX 4090, Asus says that its advanced cooler combined with extremely efficient thermal interface will ensure the maximum boost clocks possible, with Asus taking clear aim of producing the fastest gaming graphics card on the market.
Proper power delivery and efficient cooling are main ways to enable consistently high CPU and GPU performance these days, so when
Corsair Unveils Dominator Titanium DDR5 Kits: Reaching For DDR5-8000
Corsair has introduced its new Dominator Titanium series of DDR5 memory modules that will combine performance, capacity, and style. The new lineup of memory modules and kits will offer DRAM kits up to 192 GB in capacity at data transfer rates as high as DDR5-8000.
The Dominator Titanium DIMMs are based on cherry-picked memory chips and Corsair's own printed circuit boards to ensure signal quality and integrity. Also, these PCBs are supplemented with internal cooling planes and external thermal pads that
SK Hynix Publishes First Info on HBM3E Memory: Ultra-wide HPC Memory to Reach 8 GT/s
SK Hynix was one of the key developers of the original HBM memory back in 2014, and the company certainly hopes to stay ahead of the industry with this premium type of DRAM. On Tuesday, buried in a note about qualifying the company's 1bnm fab process, the the manufacturer remarked for the first time that it is working on next-generation HBM3E memory, which will enable speeds of up to 8 Gbps/pin and will be available in 2024.
Phison Unveils PS5031-E31T SSD Platform For Lower-Power Mainstream PCIe 5 SSDs
At Computex 2023, Phison is introducing a new, lower-cost SSD controller for building mainstream PCIe 5.0 SSDs. The Phison PS5031-E31T is a quad channel, DRAM-less controller for solid-state drives that is designed to offer sequential read/write speeds up to 10,8 GB/s at drive capacities of up to 8 TB, which is in line with some of the fastest PCIe 5.0 SSDs available today.
The Phison
Intel Discloses New Details On Meteor Lake VPU Block, Lays Out Vision For Client AI
While the first systems based on Intel’s forthcoming Meteor Lake (14 th Gen Core) systems are still at least a few months out – and thus just a bit too far out to show off at Computex – Intel is already laying the groundwork for Meteor Lake’s forthcoming launch. For this year’s show, in what’s very quickly become an AI-centric event, Intel is using Computex to lay out their vision of client-side AI inference for the next generation of systems. This
NVIDIA: Grace Hopper Has Entered Full Production & Announcing DGX GH200 AI Supercomputer
Teeing off an AI-heavy slate of announcements for NVIDIA, the company has confirmed that their Grace Hopper “superchip” has entered full production. The combination of a Grace CPU and Hopper H100 GPU, Grace Hopper is designed to be NVIDIA’s answer for customers who need a more tightly integrated CPU + GPU solution for their workloads – particularly for AI models.
In the works for a few years now, Grace Hopper is NVIDIA’s efforts to leverage both their existing strength in the GPU space and
Arm Unveils 2023 Mobile CPU Core Designs: Cortex-X4, A720, and A520 - the Armv9.2 Family
Throughout the world, if there's one universal constant in the smartphone and mobile device market, it's Arm. Whether it's mobile chip makers basing their SoCs on Arm's fully synthesized CPU cores, or just relying on the Arm ISA and designing their own chips, at the end of the day, Arm underlies virtually all of it. That kind of market saturation and relevance is a testament to all of the hard work that Arm has done in the last few decades getting to this point,
TSMC Preps 6x Reticle Size Super Carrier Interposer for Extreme SiP Processors
As part of their efforts to push the boundaries on the largest manufacturable chip sizes, Taiwan Semiconductor Manufacturing Co. is working on its new Chip-On-Wafer-On-Substrate-L (CoWoS-L) packaging technology that will allow it to build larger Super Carrier interposers. Aimed at the 2025 time span, the next generation of TSMC's CoWoS technology will allow for interposers reaching up to six times TSMC's maximum reticle size, up from 3.3x for their current interposers